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Publications associées (76)

Fabrication Trials of Round Strands Composed of Coated Conductor Tapes

Pierluigi Bruzzone, Davide Uglietti, Rainer Wesche

Various techniques have been proposed in order to assemble coated conductor tapes into high current strands. In this work, the preparation of high current capacity round strands starting from industrial coated conductors has been investigated. Round, twist ...

2013

Deformation and Damage in Lead-free Solder Joints

Milad Maleki

For environmental reasons, lead has been banned from microelectronic solder materials since the adoption of the RoHS legislation in 2006. A large number of investigations have lead to the development of new lead-free solder materials like the SnAgCu alloy ...

EPFL2012

Analysis of Defective Interconnections of the 13 kA LHC Superconducting Bus Bars

Luca Bottura, Pier Paolo Granieri

The interconnections between Large Hadron Collider (LHC) main dipole and quadrupole magnets are made of soldered joints of two superconducting cables stabilized by a copper bus bar. The 2008 incident revealed the possible presence of defects in the interco ...

2012

Analysis of Defective Interconnections of the 13 kA LHC Superconducting Bus Bars

Luca Bottura, Pier Paolo Granieri

Ieee-Inst Electrical Electronics Engineers Inc2012

On the Mutual Effect of Viscoplasticity and Interfacial Damage Progression in Interfacial Fracture of Lead-Free Solder Joints

John Botsis, Joël Cugnoni, Milad Maleki

The main goal of this paper is to shed light on the effect of strain rate and viscoplastic deformation of bulk solder on the interfacial failure of lead-free solder joints. For this purpose, interfacial damage evolution and mode I fracture behavior of the ...

Springer US2011

Mechanical and microstructural integrity of nickel-titanium and stainless steel laser joined wires

Michel Rappaz, Alireza Karimi, Aïcha Hessler-Wyser, Jean-Marie Drezet, Jonas Vannod

The biomedical industry shows increasing interest in the joining of dissimilar metals, especially with the aim of developing devices that combine different mechanical and corrosive properties. As an example, nickel titanium shape memory alloys joined to st ...

Elsevier2011

Challenges for Capillary Self-Assembly of Microsystems

Massimo Mastrangeli

Within the currently rising trend of heterogeneous microsystem integration and packaging, capillary self-assembly emerges as an innovative technique to enhance, complement and eventually replace pick-and-place assembly. Vast literature and experimental dat ...

2011

Fast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-Assembly

Massimo Mastrangeli

Selective chemical preconditioning of geometrically patterned substrates and parts is necessary to enable capillary part-to-substrate self-assembly. On the other hand, long preparation procedures may preclude the throughput enhancement potentially brought ...

American Society of Mechanical Engineers2010

Dispensing and hermetic sealing Rb in a miniature reference cell for integrated atomic clocks

Herbert Shea, Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Vinu Lalgudi Venkatraman

An innovative method for filling and sealing the reference cell for a Rubidium (Rb) integrated atomic clock is presented. We used a simple, low-temperature solder sealing technique for producing mini-cells of the size of 12 x 10 x 2 mm, suitable for Rb min ...

Elsevier Science, Reg Sales Off, Customer Support Dept, 655 Ave Of The Americas, New York, Ny 10010 Usa2010

Estimation of interfacial fracture toughness based on progressive edge delamination of a thin transparent coating on a polymer substrate

Yves Leterrier

Evaluation of interfacial toughness of sub-micron-thickness layers deposited on a ductile substrate is a challenging task which has motivated different experimental approaches Fragmentation testing was used in the present study as a means of interface char ...

Elsevier2010

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