Concept
System in package
Publications associées (110)
Eco-Conscious Approach to Wireless Gas Monitoring With a Hybrid Printed Passive Sensor Tag
Johanna Zikulnig, Jürgen Kosel
Addressing the environmental impact of electronic waste in biomedical sensing, an eco-conscious approach to the realization of a Chitosan-based Acetone sensor tag for wireless gas monitoring is presented. The fabrication involves inkjet printing of silver ...
Ieee-Inst Electrical Electronics Engineers Inc2024System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms
David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Rafael Medina Morillas, Joshua Alexander Harrison Klein
Multi-Chiplet architectures are being increasingly adopted to support the design of very large systems in a single package, facilitating the integration of heterogeneous components and improving manufacturing yield. However, chiplet-based solutions have to ...
2023REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal
David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Darong Huang, Rafael Medina Morillas
2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...
2023Integrated silicon photonic MEMS
Niels Quack, Hamed Sattari, Alain Yuji Takabayashi
Silicon photonics has emerged as a mature technology that is expected to play a key role in critical emerging applications, including very high data rate optical communications, distance sensing for autonomous vehicles, photonic-accelerated computing, and ...
SPRINGERNATURE2023Sub-kHz-Linewidth External-Cavity Laser (ECL) With Si3N4 Resonator Used as a Tunable Pump for a Kerr Frequency Comb
Combining optical gain in direct-bandgap III-V materials with tunable optical feedback offered by advanced photonic integrated circuits is key to chip-scale external-cavity lasers (ECL), offering wideband tunability along with low optical linewidths. Exter ...
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023A 128-kbit GC-eDRAM With Negative Boosted Bootstrap Driver for 11.3x Lower-Refresh Frequency at a 2.5% Area Overhead in 28-nm FD-SOI
Andreas Peter Burg, Robert Giterman, Halil Andac Yigit, Emmanuel Nieto Casarrubias
Gain-cell embedded DRAM (GC-eDRAM) is a high-density logic-compatible alternative to conventional static random-access memory (SRAM) and embedded DRAM (eDRAM). However, GC-eDRAM suffers from a reduced data retention time (DRT) at deeply-scaled process node ...
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023AstriFlash: A Flash-Based System for Online Services
Babak Falsafi, Lei Yan, Siddharth Gupta, Mark Johnathon Sutherland, Yunho Oh
Modern datacenters host datasets in DRAM to offer large-scale online services with tight tail-latency requirements. Unfortunately, as DRAM is expensive and increasingly difficult to scale, datacenter operators are forced to consider denser storage technolo ...
2022Thermal and Power-Aware Run-Time Performance Management of 3D MPSoCs with Integrated Flow Cell Arrays
David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Alexandre Sébastien Julien Levisse, Halima Najibi
Flow Cell Arrays (FCA) technology employs microchannels filled with an electrolytic fluid to concurrently provide cooling and power generation to integrated circuits (ICs). This solution is particularly appealing for Three-Dimensional Multi-Processor Syste ...
2022Thermal and Voltage-Aware Performance Management of 3D MPSoCs with Flow Cell Arrays and Integrated SC Converters
David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Alexandre Sébastien Julien Levisse, Halima Najibi
Flow cell arrays (FCAs) concurrently provide efficient on-chip liquid cooling and electrochemical power generation. This technology is especially promising for three-dimensional multi-processor systems-on-chip (3D MPSoCs) realized in deeply scaled technolo ...
2022Micro 3D printing of a functional MEMS accelerometer
Luis Guillermo Villanueva Torrijo, Damien Maillard, Göran Stemme, Simone Pagliano
Microelectromechanical system (MEMS) devices, such as accelerometers, are widely used across industries, including the automotive, consumer electronics, and medical industries. MEMS are efficiently produced at very high volumes using large-scale semiconduc ...
SPRINGERNATURE2022