Publications associées à Encapsulation (électronique)

Jean-Michel Sallese, Farzan Jazaeri, Wladyslaw Grabinski, Antonios Bazigos, Anurag Mangla, Maria-Anna Chalkiadaki

The design of advanced integrated circuits (IC) in particular for low power analog and radio-frequency (RF) application becomes more complex as the device level modeling confronting challenges in micro- and nano-meter CMOS processes. As present CMOS techno ...

Ieee2015

ICCAD 2015 Contest in 3D Interlayer Cooling Optimized Network

David Atienza Alonso, Arvind Raj Mahankali Sridhar

Microchannel liquid cooling has been proposed since the late 2000s as a viable enabler for 3D integration of microprocessors to continue scaling of computing power in the face of increasingly reduced returns from CMOS technology scaling. Thermal and electr ...

ACM/IEEE Press2015

A Subcutaneous Biochip for Remote Monitoring of Human Metabolism: Packaging and Biocompatibility Assessment

Giovanni De Micheli, Sandro Carrara, Jacopo Olivo, Andrea Cavallini, Seyedeh Sara Ghoreishizadeh

This paper represents the extended version of the conference paper “Developing highly-integrated subcutaneous biochips for remote monitoring of human metabolism” pre- sented at the IEEE Sensors Conference 2012, and presents data on assembly, packaging and ...

Institute of Electrical and Electronics Engineers2015

Microstereolithography

Philippe Renaud, Arnaud Bertsch

Microstereolithography is a 3D microfabrication technology that is fundamentally different from the techniques commonly used in cleanroom environment for the manufacturing of microelectromechanical system (MEMS) components. Most microfabrication techniques ...

Elsevier2015

Post-cmos processing and 3d integration based on dry-film lithography

Carlotta Guiducci, Yusuf Leblebici, Yüksel Temiz

A method for performing a post processing pattern on a diced chip having a foot-print, comprises the steps of providing a support wafer; applying a first dry film photoresist to the support wafer; positioning a mask corresponding to the footprint of the di ...

2015

Timber Folded Plate Structures – Folded Form Analysis

Yves Weinand, Christopher Werner Matthias Robeller, Andrea Stitic

This paper analyses the potential of different possible folded form topologies for generating timber folded surface structures. The main advantage of such structures lies primarily in the realm of ecology and sustainability. By offering an integral way of ...

2015

Optimization of the force and power consumption of a microfabricated magnetic actuator

Herbert Shea, Juan José Zarate

The force (F) and the power consumption (P ) of a magnetic actuator are modeled, measured and optimized in the context of developing micro-actuators for large arrays, such as in portable tactile displays for the visually impaired. We present a novel analyt ...

Elsevier2015

Femtosecond laser-based production of 3D micro- and nano-devices in transparent substrate: a step toward system-materials

Yves Bellouard

Femtosecond laser irradiation applied to Fused Silica (the amorphous form of SiO2) defines a novel technology platform for highly integrated all-optical microsystems and beyond. In contrast with common approaches that rely on combining materials to achieve ...

Spie-Int Soc Optical Engineering2015

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Encapsulation (électronique)

FOSS EKV 2.6 parameter extractor

ICCAD 2015 Contest in 3D Interlayer Cooling Optimized Network

A Subcutaneous Biochip for Remote Monitoring of Human Metabolism: Packaging and Biocompatibility Assessment

Microstereolithography

Post-cmos processing and 3d integration based on dry-film lithography

Timber Folded Plate Structures – Folded Form Analysis

Optimization of the force and power consumption of a microfabricated magnetic actuator

Multi-Gigabyte On-Chip DRAM Caches for Servers

Timber Folded Plate Structures – Topological and Structural Considerations

Femtosecond laser-based production of 3D micro- and nano-devices in transparent substrate: a step toward system-materials

Graph Chatbot

Chattez avec Graph Search

Femtosecond laser-based production of 3D micro- and nano-devices in transparent substrate: a step toward system-materials

Timber Folded Plate Structures – Topological and Structural Considerations

Timber Folded Plate Structures – Folded Form Analysis

Multi-Gigabyte On-Chip DRAM Caches for Servers

FOSS EKV 2.6 parameter extractor

ICCAD 2015 Contest in 3D Interlayer Cooling Optimized Network

A Subcutaneous Biochip for Remote Monitoring of Human Metabolism: Packaging and Biocompatibility Assessment

Post-cmos processing and 3d integration based on dry-film lithography

Microstereolithography

Optimization of the force and power consumption of a microfabricated magnetic actuator