Publications associées à Zen 3

Gem5-X: A Gem5-Based System Level Simulation Framework to Optimize Many-Core Platforms

David Atienza Alonso, Marina Zapater Sancho, William Andrew Simon, Yasir Mahmood Qureshi

The rapid expansion of online-based services requires novel energy and performance efficient architectures to meet power and latency constraints. Fast architectural exploration has become a key enabler in the proposal of architectural innovation. In this p ...

IEEE2019

BLADE: A BitLine Accelerator for Devices on the Edge

David Atienza Alonso, Marina Zapater Sancho, Alexandre Sébastien Julien Levisse, William Andrew Simon, Yasir Mahmood Qureshi

The increasing ubiquity of edge devices in the consumer market, along with their ever more computationally expensive workloads, necessitate corresponding increases in computing power to support such workloads. In-memory computing is attractive in edge devi ...

2019

HetExchange: Encapsulating heterogeneous CPU-GPU parallelism in JIT compiled engines

Anastasia Ailamaki, Manolis Karpathiotakis, Raja Appuswamy, Periklis Chrysogelos

Modern server hardware is increasingly heterogeneous as hardware accelerators, such as GPUs, are used together with multicore CPUs to meet the computational demands of modern data analytics workloads. Unfortunately, query parallelization techniques used by ...

2019

Circuit Design, Architecture and CAD for RRAM-based FPGAs

Xifan Tang

Field Programmable Gate Arrays (FPGAs) have been indispensable components of embedded systems and datacenter infrastructures. However, energy efficiency of FPGAs has become a hard barrier preventing their expansion to more application contexts, due to two ...

EPFL2017

A Power-Efficient 3-D On-Chip Interconnect for Multi-Core Accelerators with Stacked L2 Cache

Giovanni De Micheli, Luca Benini

The use of multi-core clusters is a promising option for data-intensive embedded applications such as multi-modal sensor fusion, image understanding, mobile augmented reality. In this paper, we propose a power-efficient 3-D on-chip interconnect for multi-c ...

IEEE2016

Cost-Effective Design of Mesh-of-Tree Interconnect for Multi-Core Clusters with 3-D Stacked L2 Scratchpad Memory

Giovanni De Micheli, Luca Benini

3-D integrated circuits (3-D ICs) offer a promising solution to overcome the scaling limitations of 2-D ICs. However, using too many through-silicon-vias (TSVs) pose a negative impact on 3-D ICs due to the large overhead of TSV (e.g., large footprint and l ...

Institute of Electrical and Electronics Engineers2015

Temperature-Aware Runtime Power Management for Chip-Multiprocessors with 3-D Stacked Cache

Giovanni De Micheli, Siang-Yun Lee

The advent of 3-D fabrication technology makes it possible to stack a large amount of last-level cache memory onto a multi-core die to reduce off-chip memory accesses and, thus, increases system performance. However, the higher power density (i.e., power d ...

2014

Die-Stacked DRAM Caches for Servers: Hit Ratio, Latency, or Bandwidth? Have It All with Footprint Cache

Babak Falsafi, Stavros Volos, Dorde Jevdic

Recent research advocates using large die-stacked DRAM caches to break the memory bandwidth wall. Existing DRAM cache designs fall into one of two categories — block-based and page-based. The former organize data in conventional blocks (e.g., 64B), ensurin ...

ACM2013

Through Silicon Via-Based Grid for Thermal Control in 3D Chips

David Atienza Alonso, Yusuf Leblebici, Arvind Raj Mahankali Sridhar, José Luis Ayala Rodrigo, Vinod Pangracious

3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between processing cores, and an effective way to diminish this impact on communica ...

Springer2009