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Graphene Field Effect Devices Operating in Differential Circuit Configuration

Solid-On-Liquid Technology for Suspended Microchannel Fabrication

Nanoelectromechanical digital logic circuits using curved cantilever switches with amorphous-carbon-coated contacts

A 6.7 MHz nanoelectromechanical ring oscillator using curved cantilever switches coated with amorphous carbon

A 6.7 MHz Nanoelectromechanical Ring Oscillator Using Curved Cantilever Switches Coated with Amorphous Carbon

Large-area compatible fabrication and encapsulation of inkjet-printed humidity sensors on flexible foils with integrated thermal compensation

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Fabrication of structured anode-supported solid oxide fuel cell by powder injection molding

Inkjet Printing of Interdigitated Capacitive Chemical Sensors with Reduced Size by the Introduction of a Dielectric Interlayer

Inkjet Printing of Interdigitated Capacitive Chemical Sensors with Reduced Size by the Introduction of a Dielectric Interlayer

Nanoelectromechanical digital logic circuits using curved cantilever switches with amorphous-carbon-coated contacts

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Solid-On-Liquid Technology for Suspended Microchannel Fabrication

Inkjet Printing of Interdigitated Capacitive Chemical Sensors with Reduced Size by the Introduction of a Dielectric Interlayer

A 6.7 MHz Nanoelectromechanical Ring Oscillator Using Curved Cantilever Switches Coated with Amorphous Carbon

A 6.7 MHz nanoelectromechanical ring oscillator using curved cantilever switches coated with amorphous carbon

Large-area compatible fabrication and encapsulation of inkjet-printed humidity sensors on flexible foils with integrated thermal compensation

Graphene Field Effect Devices Operating in Differential Circuit Configuration

Fabrication of structured anode-supported solid oxide fuel cell by powder injection molding

Inkjet Printing of Interdigitated Capacitive Chemical Sensors with Reduced Size by the Introduction of a Dielectric Interlayer