Personne
Léa Deillon
Cette personne n’est plus à l’EPFL
Publications associées (13)
Nanoindentation hardness and modulus of Al2O3-SiO2-CaO and MnO-SiO2-FeO inclusions in iron
Andreas Mortensen, David Hernandez Escobar, Léa Deillon, Alejandra Inés Slagter, Eva Luisa Vogt, Jonathan Aristya Setyadji
Dataset corresponding to the following manuscript: Slagter, A., Setyadji, J.A., Vogt, E.L. et al. Nanoindentation Hardness and Modulus of Al2O3–SiO2–CaO and MnO–SiO2–FeO Inclusions in Iron. Metall Mater Trans A (2024). https://doi.org/10.1007/s11661-024-0 ...
Zenodo2024The thermally activated deformation behaviour of single-crystalline microcast aluminium wires
Andreas Mortensen, Léa Deillon, Suzanne Godelieve Alphonsine Verheyden
A microcasting process is used to produce high aspect ratio ( > 30) monocrystalline pure aluminium wires with a diameter between 14 and 115 mu m. The role of thermal activation in the plastic deformation of these microwires is measured by means of (single) ...
PERGAMON-ELSEVIER SCIENCE LTD2022Strong silicon oxide inclusions in iron
Andreas Mortensen, Léa Deillon, Alejandra Inés Slagter, Joris Pierre Everaerts
Oxide inclusions are ubiquitous in steel and are known to affect, generally in a negative sense, the mechanical performance of steel products. Micromechanical properties of those phases are therefore important, yet they have remained largely unexplored. We ...
20223D metal freeform micromanufacturing
Andreas Mortensen, Yves Bellouard, Raphaël Charvet, Fatmah Ebrahim, Cyril Dénéréaz, Léa Deillon, Tao Yang, Enrico Casamenti, Luciano Borasi, Sacha Jérémy Florentin Pollonghini
Despite remarkable progress made in recent years, producing freeform three-dimensional micro-components out of copper, silver or gold and their alloys remains an engineering challenge: current processes are either too slow to be economically viable, or pro ...
2021Processing and micro-mechanical characterization of multi-component transition MC carbides in iron
Andreas Mortensen, Goran Zagar, Léa Deillon, Marta Fornabaio, Lionel Michelet
We prepare multi-component transition monocarbides of chosen composition by arc-melting together a pre-alloy of the transition metals and cast iron. Based on the elements Ti, Ta, V, Nb and W, 51 different binary, ternary and quaternary compositions are pro ...
2021The effect of size on the plastic deformation of annealed cast aluminium microwires
Andreas Mortensen, Léa Deillon, Suzanne Godelieve Alphonsine Verheyden
Monocrystalline, cast aluminium microwires of diameter (D) below 25 mu m free of micromilling artefacts are annealed under protective atmosphere. Annealing increases the flow stress of all tested microwires, by an amount that is found, in a Haasen plot of ...
2019Laue microdiffraction characterisation of as-cast and tensile deformed Al microwires
Andreas Mortensen, Helena Van Swygenhoven, Steven Van Petegem, Léa Deillon, Suzanne Godelieve Alphonsine Verheyden
Single-crystalline cast aluminium microwires with a diameter near 15 are characterised by Laue microdiffraction. A microwire in the as-cast condition exhibits a misorientation below over a length of 500 . The measured density of geometrically necessary dis ...
TAYLOR & FRANCIS LTD2019Interface microstructure formation of dissimilar Fe/Fe-Mn-C steel RSW joints
An experiment was developed to simulate the interface between liquid high manganese carbon steel and solid ultra-low alloyed steel in a thermal gradient, corresponding to the nugget/sheet interface of resistance spot welds. Despite the large difference in ...
Elsevier Science Sa2018Stress relaxation in the presence of sudden strain bursts: Methodology and stress relaxation data of microcast aluminium microwires
Andreas Mortensen, Léa Deillon
This data article presents a methodology and the corresponding code developed to perform and process stress relaxation tests where samples display superimposed (i) classical, continuous logarithmic relaxation together with (ii) sudden displacements manifes ...
2018Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling
Michel Rappaz, Aïcha Hessler-Wyser, Léa Deillon, Thierry Hessler
Au-In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu t ...
Institute of Physics2015