Arvind Raj Mahankali Sridhar

Cette personne n’est plus à l’EPFL

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Publications associées (18)

Neural Network-Based Thermal Simulation of Integrated Circuits on GPUs

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Martino Ruggiero, Alessandro Vincenzi

With the rising challenges in heat removal in integrated circuits (ICs), the development of thermal-aware computing architectures and run-time management systems have become indispensable to the continuation of IC design scaling. These thermal-aware design ...

Institute of Electrical and Electronics Engineers2012

Thermal Balancing of Liquid-Cooled 3D-MPSoCs Using Channel Modulation

David Atienza Alonso, Arvind Raj Mahankali Sridhar

While possessing the potential to replace conventional air-cooled heat sinks, inter-tier microchannel liquid cooling of 3D ICs also creates the problem of increased thermal gradients from the fluid inlet to outlet ports [1, 2]. These cooling-induced therma ...

ACM and IEEE Press2012

Accelerating Thermal Simulations of 3D ICs with Liquid Cooling using Neural Networks

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Martino Ruggiero, Alessandro Vincenzi

Vertical integration is a promising solution to further increase the performance of future ICs, but such 3D ICs present complex thermal issues that cannot be solved by conventional cooling techniques. Interlayer liquid cooling has been proposed to extract ...

ACM2012

Fast Thermal Simulation of 2D/3D Integrated Circuits Exploiting Neural Networks and GPUs

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Martino Ruggiero, Alessandro Vincenzi

Heat removal is one of the major challenges faced in developing the new generation of high density integrated circuits. Future design technologies strongly depend on the availability of efficient means for thermal modeling and analysis. These thermal model ...

ACM and IEEE Press2011

Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Martino Ruggiero, Alessandro Vincenzi

The advent of 3D stacked ICs with accumulating heat fluxes stresses thermal reliability and is responsible for temperature driven performance deterioration of the electronic systems Hot spots with power densities typically rising up to 250 W/cm2 are not ac ...

IEEE Press2010

3D-ICE: Fast compact transient thermal modeling for 3D-ICs with inter-tier liquid cooling

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Martino Ruggiero, Alessandro Vincenzi

Three dimensional stacked integrated circuits (3D ICs) are extremely attractive for overcoming the barriers in interconnect scaling, offering an opportunity to continue the CMOS performance trends for the next decade. However, from a thermal perspective, v ...

ACM and IEEE Press2010

Thermal modeling and analysis of 3D multi-processor chips

Arvind Raj Mahankali Sridhar

As 3D chip multi-processors (3D-CMPs) become the main trend in processor development, various thermal management strategies have been recently proposed to optimize system performance while controlling the temperature of the system to stay below a threshold ...

Elsevier2010

Through Silicon Via-Based Grid for Thermal Control in 3D Chips

David Atienza Alonso, Yusuf Leblebici, Arvind Raj Mahankali Sridhar, José Luis Ayala Rodrigo, Vinod Pangracious

3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between processing cores, and an effective way to diminish this impact on communica ...

Springer2009

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