Combined Al-protection and HF-vapour release process for ultrathin cantilevers
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The ability to control high-voltage actuator arrays relies, to date, on expensive microelectronic processes or on individual wiring of each actuator to a single off-chip high-voltage switch. Here we present an alternative approach that uses on-chip photoco ...
The project focuses on etching properties of the atomic layer deposition (ALD) of Al2O3. For this purpose, etching processes such as plasma etch with sulfur hexafluoride (SF6), gas etch with xenon difluoride (XeF2), wet etch with MIF developer (726 MIF) as ...
HfC has been very under-investigated due to its rarity and synthesising difficulty. Its potential for MEMS and NEMS applications has been recognized and is the object of an ongoing feasibility study for production since 2022. We continue on this impulse by ...
The field of micro electromechanical systems (MEMS) evolved from the microelectronic industry and the technologies developed to fabricate integrated circuits. As a result, MEMS are commonly fabricated on silicon wafers. The development of MEMS has been dri ...
Dielectric breakdown etching is a well-known method of making nanopores on thin (similar to 50 nm) dielectric membranes. However, voltage driven translocation of biomolecules through such nanopores becomes extremely fast. For improved detection, for instan ...
During this project, the microfabrication of Hafnium Carbide (HfC) was investigated. Multiple tools were considered and tested for their compatibility and effectiveness when working with HfC. The main method of choice for the machining of HfC thin films wa ...
The objective of this semester project is the fabrication of suspended piezoelectrically transduced resonators and to test and compare the quality of the piezoelectric layer using different processes and parameters. A functional fabrication process by lift ...
The objective of this PhD thesis is the development of a microfluidic platform for the real-time measurements of the mechanical properties of biological analytes at the single entity level.The systems developed for these purposes consist of piezoelectrical ...
We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufacturin ...
Understanding the origins of intrinsic stress in Si nanowires (NWs) is crucial for their successful utilization as transducer building blocks in next-generation, miniaturized sensors based on nanoelectromechanical systems (NEMS). With their small size lead ...
