DUV/MEMS based stencils for full-wafer scale, resistless, patterning of mesoscopic structures
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Abstract: A simple and fast process to fabricate micro-electro-mechanical (MEM) resonators with deep sub-micron transduction gaps in thin SOI is presented. The proposed process is realized on both 350 nm and 1.5 μm thin silicon-on-insulator (SOI) substrate ...
We report on the fabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity in which electrodes are used to ignite a low power (≪500 mW ...
A simple and fast process for micro-electromechanical (MEM) resonators with deep sub-micron transduction gaps in thin SOI is presented in this paper. Thin SOI wafers are important for advanced CMOS technology and thus are evaluated as resonator substrates ...
We present two kinds of novel nanoimprint lithography techniques based on SU-8 photoresist with single layer and tri-layer approaches. The imprint templates with high aspect ratio were first fabricated by electron beam lithography (EBL) and reactive ion et ...
