Full-wafer stencils fabricated by a DUV/MEMS process for high-throughput patterning of mesoscopic structures
Graph Chatbot
Chattez avec Graph Search
Posez n’importe quelle question sur les cours, conférences, exercices, recherches, actualités, etc. de l’EPFL ou essayez les exemples de questions ci-dessous.
AVERTISSEMENT : Le chatbot Graph n'est pas programmé pour fournir des réponses explicites ou catégoriques à vos questions. Il transforme plutôt vos questions en demandes API qui sont distribuées aux différents services informatiques officiellement administrés par l'EPFL. Son but est uniquement de collecter et de recommander des références pertinentes à des contenus que vous pouvez explorer pour vous aider à répondre à vos questions.
We compare three different approaches to high-resolution contact lithography with special emphasis on contrast mechanisms for subwavelength structures. Masks with protruding metal absorbers, masks with absorbers embedded in the transparent background, and ...
Ferroelectric thin films for memory and MEMS applications require noble metal or refractory metal oxide electrodes. In this paper, physical and chemical parameters during etching of RuO2 and Pr by a dual frequency ECR/RF reactor have been investigated. The ...
We discuss the potential and limitations of Light-coupling masks for high-resolution subwavelength optical lithography. Using a three-dimensional fully vectorial numerical approach based on Green's tensor technique, the near-field distribution of the elect ...
This paper describes a method of thin film and MEMS processing which uses self-assembled monolayers as ultra-thin organic surface coating to enable a simple removal of microfabricated devices off the surface without wet chemical etching. A 1.5-nm thick sel ...
A new approach for the realization of true 3D polymer structures is presented in this paper. It consists in adding, in a post-processing microstereolithography step, 3D polymer microstructures on top of a micropart patterned by means of planar processes su ...
Light-coupling masks (LCMs) based on structured organic polymers that make conformal contact with a substrate can constitute an amplitude mask for light-based lithographies. The LCM is exposed through its backside, from where the light is differentially gu ...
Ferroelectric capacitive devices for memory and MEMS applications require patterned ferroelectric thin films with high anisotropic etched features. In this paper, physical and chemical parameters during etching of Pb(Zr0.53Ti0.47)O-3 (PZT) by a dual freque ...
Ferroelectric thin films for memory and MEMS applications require noble metal or refractory metal oxide electrodes. In this paper, physical and chemical mechanisms during platinum etching by a dual frequency ECR/RF reactor have been investigated. An ion be ...
We describe an approach to optical lithography using light-scattering contact masks with protruding elements that couple light into a photoresist. This method differs from conventional contact lithography in two important ways. First, because portions of t ...
This paper describes single and two layer processes to realize thick resist moulds (40 and 80 μm) with a good reproducibility. The patterning of a thick AZ 4562 photoresist layer is performed with standard photolithography equipment. Different problems rel ...
