Publication

Microfabrication technologies for microsystems

Publications associées (32)

A new versatile hybrid MEMS technology for high sensitivity, fluid proof sensing applications.

The field of micro electromechanical systems (MEMS) evolved from the microelectronic industry and the technologies developed to fabricate integrated circuits. As a result, MEMS are commonly fabricated on silicon wafers. The development of MEMS has been dri ...

EPFL2022

Enhanced-performance integrated Resonant Switched-Capacitor and Buck DC-DC converters for application in extreme radiation and magnetic field environments

Giacomo Ripamonti

DC-DC converters based on Application Specific Integrated Circuits (ASICs) have been developed in this doctoral work for the High-Luminosity Large Hadron Collider (HL-LHC) experiments at CERN. They step down the voltage from a 2.5 V line and supply a load ...

EPFL2020

Hybrid Si3N4-LiNbO3 integrated platform for electro-optic conversion

Tobias Kippenberg, Rui Ning Wang, Mikhail Churaev, Junqiu Liu, Tianyi Liu

We demonstrate the integration of a Si3N4 Damascene photonic platform with thin-film lithium niobate on insulator (LNOI) via direct wafer bonding. This process enables fabrication of hybrid chi((2))-chi((3)) microresonators with Q similar to 10(6), as well ...

IEEE2020

CMOS-Based Readout and Control Electronics for Microgrippers

Marco Mattavelli, Diego Ruben Barrettino

This paper presents the design of an application-specific integrated circuit (ASIC) with all the necessary electronic blocks to read out and control Conjugate Surfaces Flexure Hinge (CSFH) microgrippers. The ASIC was fabricated using a high-voltage 0.35 mu ...

IEEE2020

Toward a Full-Flexible and Fast-Prototyping TOF-PET Block Detector Based on TDC-on-FPGA

Edoardo Charbon, Esteban Venialgo Araujo

Typically, a time-of-flight (TOF) positron emission tomography (PET) block detector is built using application-specific integrated circuits (ASICs), since they integrate a high number of channels at a reasonable power consumption and into a small area. How ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2019

A programmable low-power ADC interface for an ISFET sweat sensor used in a wearable multi-sensing system

Maher Kayal, Evgenia Voulgari, François Krummenacher

An application specific integrated circuit (ASIC) named ANTIGONE (ANalog To dIGital cONvErter) was designed in AMS 0.35 mu m technology to interface with four Ion-sensitive field-effect transistor (ISFET) sensors and perform real-time monitoring of some bi ...

IEEE2019

Pediatric Size Swallowable Glass Pill for Digestive Motility Analysis

Catherine Dehollain, Vincent Schlageter, Onur Kazanç

A glass pill for digestive motility tracking with wireless communication is presented. The pill encapsulates three magnetic transmitter coils with a 125 kHz signal, the circuitry required to control the magnetic coil output and the battery. The system prov ...

IEEE2018

Fabrication of 2d Material Based Resonators

Tom Larsen, An Tran

Improvements in manufacturing processes inspired by the semiconductor integrated circuit industry have seen a sharp reduction in dimensions of microelectromechanical systems (MEMS), leading to the emergence of its submicron counterpart – nanoelectromechani ...

2017

Electronic solutions for power system emulation

Guillaume Olivier Lanz

Nowadays electric power systems are subject to continuous changes and the needs in the power generation and delivery service are constantly increasing, with a higher complexity of a progressively more distributed network. Because the impact of a failure ca ...

EPFL2017

Robustness Analysis of Controllable-Polarity Silicon Nanowire Devices and Circuits

Hassan Ghasemzadeh Mohammadi

Substantial downscaling of the feature size in current CMOS technology has confronted digital designers with serious challenges including short channel effect and high amount of leakage power. To address these problems, emerging nano-devices, e.g., Silicon ...

EPFL2016

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