Laser soldered packaging hermeticity measurement using metallic conductor resistance
Graph Chatbot
Chattez avec Graph Search
Posez n’importe quelle question sur les cours, conférences, exercices, recherches, actualités, etc. de l’EPFL ou essayez les exemples de questions ci-dessous.
AVERTISSEMENT : Le chatbot Graph n'est pas programmé pour fournir des réponses explicites ou catégoriques à vos questions. Il transforme plutôt vos questions en demandes API qui sont distribuées aux différents services informatiques officiellement administrés par l'EPFL. Son but est uniquement de collecter et de recommander des références pertinentes à des contenus que vous pouvez explorer pour vous aider à répondre à vos questions.
Mechanical and electrical connecting of piezoelectric actuator is often done using conductive glue. Its advantage is not to heat the piezoelectric actuator during connection. But there are many disadvantages to gluing; the main one is curing time. Welding ...
Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...
Abstract: Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to s ...
High temperatures, very high pressures and/or the presence of aggressive media cannot be covered by standard packaging methods, which only provide limited environmental stability. Ceramic technologies such as LTCC (Low Temperature Cofired Ceramic) and thic ...
The invention relates to novel gas-barrier materials for food packaging, based on transparent nanosized hybrid organic/inorganic films on polymer substrates. By contrast with current brittle oxides, these new materials combine extremely high cohesive stren ...
Electrostatically driven MEMS devices commonly operate with electric fields as high at 108 V/m applied across the dielectric between electrodes. Even with the best mechanical design, the electrical design of these devices has a large impact both on perform ...
Institute of Electrical and Electronics Engineers2004
