Laser soldered packaging hermeticity measurement using metallic conductor resistance
Related publications (36)
Graph Chatbot
Chat with Graph Search
Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.
DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.
Abstract: Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to s ...
Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...
Mechanical and electrical connecting of piezoelectric actuator is often done using conductive glue. Its advantage is not to heat the piezoelectric actuator during connection. But there are many disadvantages to gluing; the main one is curing time. Welding ...
High temperatures, very high pressures and/or the presence of aggressive media cannot be covered by standard packaging methods, which only provide limited environmental stability. Ceramic technologies such as LTCC (Low Temperature Cofired Ceramic) and thic ...
Electrostatically driven MEMS devices commonly operate with electric fields as high at 108 V/m applied across the dielectric between electrodes. Even with the best mechanical design, the electrical design of these devices has a large impact both on perform ...
Institute of Electrical and Electronics Engineers2004
The invention relates to novel gas-barrier materials for food packaging, based on transparent nanosized hybrid organic/inorganic films on polymer substrates. By contrast with current brittle oxides, these new materials combine extremely high cohesive stren ...