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Monolithic Silicon Chip for Immunofluorescence Detection on Single Magnetic Beads

Publications associées (32)

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Towards Scalable Electronics: Synthetic 2D Materials for Large-Area 2D Circuit Integration

Zhenyu Wang

In the past decades, a significant increase of the transistor density on a chip has led to exponential growth in computational power driven by Moore's law. To overcome the bottleneck of traditional von-Neumann architecture in computational efficiency, effo ...

EPFL2024

Integrated multiplexed microwave readout of silicon quantum dots in a cryogenic CMOS chip

Edoardo Charbon, Andrea Ruffino, Yatao Peng

Solid-state quantum computers require classical electronics to control and readout individual qubits and to enable fast classical data processing [1-3]. Integrating both subsystems at deep cryogenic temperatures [4], where solid-state quantum processors op ...

2021

Energy- and Cost-Efficient VLSI DSP Systems Design with Approximate Computing

Reza Ghanaatian Jahromi

Technology scaling has progressed to enable integrated circuits with extremely high density enabling systems of tremendous complexity with manageable power consumption. With the continuation of Moore's law for many years, electronic chips have been able to ...

EPFL2020

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The imaging of integrated circuits across different length scales is required for failure analysis, design validation and quality control. At present, such inspection is accomplished using a hierarchy of different probes, from optical microscopy on the mil ...

NATURE PUBLISHING GROUP2019

Monolithic Integration of GaN-Based NMOS Digital Logic Gate Circuits with E-Mode Power GaN MOSHEMTs

Elison de Nazareth Matioli, Minghua Zhu

In this work, we demonstrate high-performance NMOS GaN-based logic gates including NOT, NAND, and NOR by integration of E/D-mode GaN MOSHEMTs on silicon substrates. The load-to-driver resistance ratio was optimized in these logic gates by using a multi-fin ...

IEEE2018

Research and development efforts on chip and wafer-scale 3D integration for system miniaturization have been continuing for more than a decade. However, there are still only a handful of 3D integrated products available in the market due to the high cost a ...

EPFL2017

Cyber-Medical Systems: Requirements, Components and Design Examples

Giovanni De Micheli

Cyber-medical systems will produce a major revolution in health care, by both raising the quality of care and reducing its cost, thus reaching an important social and economic goal. The evolution of electronic devices and systems has already enabled societ ...

2017

Cost-Effective Design of Mesh-of-Tree Interconnect for Multi-Core Clusters with 3-D Stacked L2 Scratchpad Memory

Giovanni De Micheli, Luca Benini

3-D integrated circuits (3-D ICs) offer a promising solution to overcome the scaling limitations of 2-D ICs. However, using too many through-silicon-vias (TSVs) pose a negative impact on 3-D ICs due to the large overhead of TSV (e.g., large footprint and l ...

Institute of Electrical and Electronics Engineers2015

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

John Richard Thome, Jackson Braz Marcinichen, Yassir Madhour, Brian Paul D'Entremont, Bruno Michel

Three-dimensional (3D) stacking of integrated-circuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with area-array through-silicon-vias (TSVs). This reduces the length of global interconnects and t ...

American Society of Mechanical Engineers2014

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Two-phase liquid cooling of computer chips via microchannels etched directly on silicon dies is a potential long-term solution to enable continued integration of high-performance multiprocessors. Two-phase cooling refers to the heat removal via evaporation ...

IEEE/ACM Press2013