Carbon Nanotube Electromechanical Devices for Radio Frequency Applications

Carbon nanotubes (CNT) have been investigated extensively in the recent years for application in nano-electromechanical systems (NEMS). CNTs have extraordinary electrical and mechanical properties. They are stiff, with low density, high electrical conductivity and hence are the ideal candidates for NEMS. Beyond miniaturization, NEMS can also offer better performance than its predecessor micro-electro mechanical systems (MEMS). NEMS find application in ultra-sensitive mass and force detection, RF signal processing, low power operated switches with fast switching speeds, to name a few. Despite tremendous promise the main challenge in CNT research has been the fabrication technology to realize CNT based devices with precise control of location and properties of CNT. CNTs are one-dimensional structures with high aspect ratio. To realize devices for practical application with high signal-to-noise-ratio, it becomes necessary to operate many of them in parallel. To fabricate an array of CNTs in parallel posse's additional challenge to the fabrication technology but the resulting structures could provide benefits compared to both NEMS fabricated with one dimensional structures and MEMS. During the course of this thesis, different fabrication technologies were investigated to realize CNT array based devices. A self assembly method, dielectrophoresis and CVD growth were optimized to realize CNT based devices. A novel technique using a modified dielectrophoresis method was setup to be able to trap a single CNT. A CNT crossed junction was fabricated using the same. The electrical properties of the junction were studied. A Suspended Gate CNT array Field Effect Transistor (SG-CNT-FET) based resonator was demonstrated for the first time. SG-CNT-FET combines the excellent mechanical properties of CNTs with the gain of the solid state field effect transistor. The use of an array configuration ensures better signal-to-noise-ratio compared to device implemented with a single CNT. A novel process flow combining the fabrication of a FET and deposition of CNTs by dielectrophoresis was developed. Resonance frequency up to 150 MHz with a quality factor of approximately 50 was obtained. The resonance frequency is tuneable by modulating the tension in the CNT array by applying a DC bias. Dependence of the resonance frequency on the applied bias has been studied under the frame work of a continuum mechanics model. The small signal circuit parameters have been extracted, enabling future circuit design. Vertically grown CNT array were grown on metal lines to realize a tuneable MEM capacitor. The CNT array forms a membrane like structure which can be electro-statically actuated. Morphological and electrical characterizations were performed on the fabricated devices. DC characterization revealed the pull-in behavior like conventional MEMS. The Young's modulus of the grown vertical CNT array was extracted from the measured pull-in voltage. An effective Young's modulus of 30-100 MPa was obtained. An equivalent electrical model was developed to extract the capacitance from the S-parameters measurements, measured up to 6 GHz. The model was validated by ADS circuit simulations. A voltage controlled oscillator at 2.45 GHz has been implemented using the thus realized tuneable MEM capacitor.

A new versatile hybrid MEMS technology for high sensitivity, fluid proof sensing applications.

Matthias Neuenschwander

The field of micro electromechanical systems (MEMS) evolved from the microelectronic industry and the technologies developed to fabricate integrated circuits. As a result, MEMS are commonly fabricated on silicon wafers. The development of MEMS has been driven by three main merits: miniaturisation, microelectronics integration, and parallel fabrication with high precision. Many operational properties scale well with smaller sizes. In addition, integrated electronic circuitry allows embedding MEMS with computing or networking capabilities, while parallel manufacturing enables the fabrication of many identical devices on a single wafer, reducing the unit cost. The main MEMS application is transducers which transform signals from one form of energy to another, and can be used for perception (sensors) or to produce actions (actuators). Silicon and other microelectronic materials like metals have enabled very high-performance MEMS transducers because these materials can be used for a range of very effective actuating and sensing principles.More recently, polymers have started to be used in MEMS because of their unique electrical, physical and chemical properties which include biocompatibility, viscoelasticity and mechanical shock tolerance. They are also much softer than silicon or metals, and they can be processed using many techniques that allow unique low-cost, batch-style fabrication and packaging. However, polymers have relatively low glass-transition and melting temperatures. As a result, the advantages of polymers cannot easily be combined with high-performance actuating and sensing elements as these are based on silicon technology and require high-temperature fabrication steps. Here, a hybrid-MEMS fabrication process is used to address this issue. The developed devices are based on a trilayer structure, where a thick polymer core is sandwiched between two hard thin films, while electronic layers are embedded within in a fluid-compatible way.The objective of this thesis is to turn hybrid-MEMS into a benchmark MEMS technology. This involves many different aspects. First, sensing and actuation elements are integrated into trilayer devices, and their performance is analysed. Then, some more unique possibilities offered by hybrid-MEMS are exploited. A way to fabricate electronics on multiple layers is developed, which allows different electronic features to be integrated in parallel. In addition, three-dimensional bulk features fabricated at several levels are demonstrated. This is possible because the hybrid-MEMS process is based on the bonding of multiple wafers.All these new fabrication features are demonstrated in atomic force microscopy (AFM) applications. Self-actuated trilayer AFM cantilevers with sharp silicon tips are used to boost imaging speeds in the off-resonance tapping (ORT) mode, thanks to an order of magnitude faster surface probing rates. Furthermore, fully integrated ORT imaging is demonstrated with self-actuated piezoresistive cantilevers. Next, trilayer cantilevers with shielded conductive tips are introduced for electrical AFM modes. Finally, ongoing research projects are touched upon, including approaches to fabricate hybrid-MEMS with single crystal silicon piezoresistors for improved sensitivity, and an analysis of reproducibility of fabricated trilayer cantilevers.

EPFL2022

Fabrication of 2d Material Based Resonators

Tom Larsen, An Tran

Improvements in manufacturing processes inspired by the semiconductor integrated circuit industry have seen a sharp reduction in dimensions of microelectromechanical systems (MEMS), leading to the emergence of its submicron counterpart – nanoelectromechanical systems (NEMS). NEMS resonators, nano-scale vibrating structures, have proven to be extremely sensitive sensors of physical phenomena which affect its resonance behaviour. The arrival of graphene and other 2D materials with ultrahigh surface to volume ratio, ultralow mass and a diverse range of superior electrical and mechanical properties marked an important moment in NEMS resonators’ history as the reality of having extremely sensitive NEMS resonator based sensors seems imminent. Although a fair amount of research has demonstrated the potential of 2D materials for NEMS resonators, the employed fabrication methods either are not scalable or involve too many fabrication steps. An efficient and mass-reproducible fabrication process for 2D material based NEMS resonators has been successfully demonstrated. This fabrication method is predicted to be compatible with any 2D materials although graphene was chosen for availability and cost purposes. Metal electrodes for electrostatic actuation and detection are lithographically patterned on a silicon wafer with wet thermal oxide which was then diced into small substrates to host graphene. Graphene was transferred using a wet-transfer method on these electrode chips before being optimally patterned with photolithography and oxygen plasma etch. Freestanding graphene beams were obtained by wet etching the underlying oxide and critical point drying. Compared to the existing large-scale fabrication methods of 2D material based NEMS resonators, suspended graphene is clamped on top of metal electrodes fabricated on the wafer level, resulting in a smaller number of fabrication steps and minimal exposure of graphene to sacrificial layers. The fabricated devices were electrically characterised and the graphene’s sheet resistances were derived and benchmarked against those found in literature. The characteristic bipolar field effect transistor (FET) behaviour of graphene was confirmed. The generic fabrication approach demonstrated in this thesis holds great promise for 2D material based resonators being fabricated with high reproducibility and scalability.

2017

A new versatile hybrid MEMS technology for high sensitivity, fluid proof sensing applications.

Matthias Neuenschwander

EPFL2022

Fabrication of 2d Material Based Resonators

Tom Larsen, An Tran

2017