Die-Level TSV Fabrication Platform for CMOS-MEMS Integration
Publications associées (43)
Graph Chatbot
Chattez avec Graph Search
Posez n’importe quelle question sur les cours, conférences, exercices, recherches, actualités, etc. de l’EPFL ou essayez les exemples de questions ci-dessous.
AVERTISSEMENT : Le chatbot Graph n'est pas programmé pour fournir des réponses explicites ou catégoriques à vos questions. Il transforme plutôt vos questions en demandes API qui sont distribuées aux différents services informatiques officiellement administrés par l'EPFL. Son but est uniquement de collecter et de recommander des références pertinentes à des contenus que vous pouvez explorer pour vous aider à répondre à vos questions.
A System-in-Package (SiP) concept for the 3D-integration of a Single Wall Carbon Nanotube (SWCNT) resonator with its CMOS driving electronics is presented. The key element of this advanced SiP is the monolithic 3D-integration of the MEMS with the CMOS elec ...
SPIE - International Society of Optical Engineering2013
The main aim of this thesis is to examine the advantages of 3D stacking applied to microprocessors and related integrated microprocessor systems in the architectural level. In the succession of years microprocessors are aiming towards lower power consumpti ...
Through silicon vias (TSVs) provide an efficient way to support vertical communication among different layers of a vertically stacked chip, enabling scalable 3-D networks-on-chip (NoC) architectures. Unfortunately, low TSV yields significantly impact the f ...
The emerging three-dimensional (3D) integration technology is expected to lead to an industry paradigm shift due to its tremendous benefits. Intense research activities are going on about technology, simulation, design, and product prototypes. This thesis ...
The performance of most digital systems today is limited by the interconnect latency between logic and memory, rather than by the performance of logic or memory itself. Three- dimensional (3-D) integration using through-silicon-vias (TSVs) may provide a so ...
This study adds a new dimension to lab-on-a-chip systems by employing three-dimensional (3D) integration technology for improved performance, higher functionality, and on-chip computational power. Despite the extensive amount of current research on 3D memo ...
Growing demands for increased functionality in consumer electronics and for information technology-enabled services in various sectors have resulted in the rise of high-performance multiprocessor system-on-chips (MPSoCs) and three-dimensionally stacked int ...
This semester project is a proof of concept for the production of Lego R -like bricks in MEMS. Several design iterations have been made using milimeter-scale, o-chip fabrication methods. The nal product consists of 3mmx6mmx2mm bricks made of PDMS enriched ...
In the framework of the NanoTera project CabTuRes, a system-in-package for a nano-resonator was proposed, integrating CMOS driving electronics and vacuum encapsulation. This doctoral research aimed to investigate 3D-integration technologies for a Single-Wa ...
Femtosecond laser processing of glass has been proven to be an efficient tool for fabricating waveguides and microchannels. Here we show that monolithic integration in bio-Micro- Electro-Mechanical-Systems can be pushed forward by introducing additional fu ...
