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Die-Level TSV Fabrication Platform for CMOS-MEMS Integration

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Die-Level TSV Fabrication Platform for CMOS-MEMS Integration

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Chattez avec Graph Search

Flip-chip integration of Si bare dies on polymeric substrates at low temperature using ICA vias made in dry film photoresist

Methods and systems for power-efficient inductive chip-to-chip communications

A Die-Level Post-CMOS Processing Protocol for Multi-Layer 3D Integration

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Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

Parallel vs. Serial Inter-plane communication using TSVs

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Parallel vs. Serial Inter-plane communication using TSVs

A Die-Level Post-CMOS Processing Protocol for Multi-Layer 3D Integration

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

3D-ICE: a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

Flip-chip integration of Si bare dies on polymeric substrates at low temperature using ICA vias made in dry film photoresist

Methods and systems for power-efficient inductive chip-to-chip communications

Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication