Effects of Ni additions, trace elements and solidification kinetics on microstructure formation in Sn-0.7Cu solder
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Surface alloying of Cu(001) by Sn deposition is a finely controllable method of tuning the degree of copper reactivity in order to drive the on-surface assembly and synthesis of metal-organic coordination networks. In this work we show that the (3 root 2 x ...
Rapid solidification of Al-Cu droplets of eutectic composition was carried out using Impulse Atomization (a type of drop tube). Two distinct morphologies were observed: an irregular undulated eutectic assumed to form during recalescence, followed by a regu ...
It has been discovered quite recently that Icosahedral Short-Range Order (ISRO) of atoms in the liquid phase of metallic alloys surrounding some trace elements added to the melt can influence both the nucleation and growth of the primary phase. In this wor ...
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Age hardening induced by the formation of (semi)-coherent precipitate phases is crucial for the processing and final properties of the widely used Al-6000 alloys despite the early stages of precipitation are still far from being fully understood. This cruc ...
Recently, we have shown that minute Cr additions (typically 0.1 wt%) to Al-Zn alloys solidified in a uniform temperature field lead to the formation of fine equiaxed fcc Al grains [1]. Furthermore, these grains exhibit an unexpectedly large number of twin, ...
During solidification of metallic alloys, coalescence corresponds to the formation of solid bridges between grains when both solid and liquid phases are percolated. As such, it represents a key transition with respect to the mechanical behaviour of solidif ...
During solidification of metallic alloys, coalescence leads to the formation of solid bridges between grains or grain clusters when both solid and liquid phases are percolated. As such, it represents a key transition with respect to the mechanical behavior ...
In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu joints are subjected to elevated homologous temperatures f ...
