Influence of CH2 content and network defects on the elastic properties of organosilicate glasses
Graph Chatbot
Chattez avec Graph Search
Posez n’importe quelle question sur les cours, conférences, exercices, recherches, actualités, etc. de l’EPFL ou essayez les exemples de questions ci-dessous.
AVERTISSEMENT : Le chatbot Graph n'est pas programmé pour fournir des réponses explicites ou catégoriques à vos questions. Il transforme plutôt vos questions en demandes API qui sont distribuées aux différents services informatiques officiellement administrés par l'EPFL. Son but est uniquement de collecter et de recommander des références pertinentes à des contenus que vous pouvez explorer pour vous aider à répondre à vos questions.
A dual-polarized system fully implemented in substrate integrated technology is presented. It comprises an Orthomode Transducer (OMT) with planar excitation schemes for both orthogonal TE10 and TE01 modes and a dual-polarized horn antenna. The whole struct ...
Institute of Electrical and Electronics Engineers2014
Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...
The electronics industry is present nowadays in the most various applications. A new type of technology for integrated circuits named BCD has started to be developed and appeared from the mid 1980’s. This new technology allows integrating bipolar transisto ...
A new approach for inserting repeaters in 3-D interconnects is proposed. The allocation of repeaters along an interplane interconnect is iteratively determined. The proposed approach is compared with two other techniques based on conventional methods used ...
Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...
With technology scaling reaching the fundamental limits of Si-CMOS in the near future, the semiconductor industry is in quest for innovation from various disciplines of integrated circuit (IC) design. At a fundamental level, technology forms the main drive ...
Dendronized polymers consist of an elastic backbone with a set of iterated branch structures (dendrimers) attached at every base point of the backbone. The conformations of such molecules depend on the elastic deformation of the backbone and the branches, ...
The overall aim of this thesis has been to assess the potential of latex-based technologies for the preparation of polymer/clay nanocomposites. The key feature of latex-based technologies is that they offer the possibility of improved control of the final ...
Atomistic simulations show that organosilicates, used as low permittivity dielectric materials in advanced integrated circuits, can be made substantially stiffer than amorphous silica, while maintaining a lower mass density The enhanced stiffness is achiev ...
Dielectric elastomers are highly promising as functional materials for the rapidly developing field of flexible actuator and generator technology. They offer a unique combination of low densities and large reversible deformations of up to more than 100% in ...