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Characterization and Implementation of Fault-Tolerant Vertical Links for 3-D Networks-on-Chip

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Characterization and Implementation of Fault-Tolerant Vertical Links for 3-D Networks-on-Chip

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Chattez avec Graph Search

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A 110mW 6 Bit 36GS/S Interleaved SAR ADC for 100 GBE Occupying 0.048mm2 in 32nm SOI CMOS

Flip-chip integration of Si bare dies on polymeric substrates at low temperature using ICA vias made in dry film photoresist

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Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography

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