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Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations

Publications associées (73)

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A modular multiple frequency inductive link to wirelessly power multiple miniaturized implants

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A modular multiple frequency coils inductive link system to wirelessly provide power for at least a medical implant at an output of a receiving coil, whereby the receiving coil is configured to be implanted in an organism. The modular multiple frequency co ...

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Graph generative deep learning models with an application to circuit topologies

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Magnonics is a research field that has gained an increasing interest in both the fundamental and applied sciences in recent years. This field aims to explore and functionalize collective spin excitations in magnetically ordered materials for modern informa ...

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Electrification of the energy section, from generation to end-use, plays an essential role in reducing global CO2 emission. Innovations in power electronics are required to increase conversion efficiency and power density. Gallium nitride (GaN) transistors ...

EPFL2022

As an increase of intelligent and self-powered devices is forecasted for our future everyday life, the implementation of energy-autonomous devices that can wirelessly communicate data from sensors is crucial. Even though techniques such as voltage scaling ...

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Bi-directional brain-machine interfaces (BBMIs) that can capture electrophysiological signals and provide feedback through electrical stimulation are emerging tools with various applica-tions in fundamental neuroscience research as well as in clinical trea ...

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Clocking power, including both clock distribution and registers, has long been one of the primary factors in the total power consumption of many digital systems. One straightforward approach to reduce this power consumption is to apply dual-edge-triggered ...

Association for Computing Machinery2017

Twentieth century has been the golden age of semiconductor industry by achieving a high level of growth as a courtesy of developments in fabrication techniques and downscaling of the technology. Since the downscaling in current lithography technology is re ...

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Integration of silicon nanowires (Si NWs) in three-dimensional (3D) devices including integrated circuits (ICs) and microelectromechanical systems (MEMS) leads to enhanced functionality and performance in diverse applications. The immediate challenge to th ...

Elsevier2017

Through silicon vias (TSVs) are key enablers of 3-D integration technologies which, by vertically stacking and interconnecting multiple chips, achieve higher performances, lower power, and a smaller footprint. Copper is the most commonly used conductor to ...

Institute of Electrical and Electronics Engineers2017