Publication
In-Situ Thin Film Growth of PbTiO3 By Multi Target Sputtering
Publications associées (32)
Porous thick-film silver metallisation for thermally mismatched brazing operations in tokamak magnetic sensor
Duccio Testa, Peter Ryser, Lucas Güniat, Thomas Maeder, Caroline Jacq, Adrien Aymeric Thibault Corne
A novel sensor based on thick-film + LTCC (low-temperature cofired ceramic) technology has been recently developed for sensing high-frequency 3D magnetic fields in tokamak fusion devices. For integration within the walls of the tokamak, the sensor has to b ...
IMAPS / ACerS2015Tuning the porosity of zinc oxide electrodes: from dense to nanopillar films
Christophe Ballif, Benoît Florent Paul Delaup, Sylvain Nicolay, Björn Niesen, Monica Morales Masis, Lorenzo Fanni
Thin films with tunable porosity are of high interest in applications such as gas sensing and antireflective coatings. We report a facile and scalable method to fabricate ZnO electrodes with tuneable porosity. By adjusting the substrate temperature and rat ...
2015Utilisation de brasure sans plomb pour le capteur de force CentoNewton
Ce rapport décrit les tests effectués sur des capteurs CentoNewton-B en cours de productions pilotes, dans le but d’utiliser à l’avenir de la brasure sans plomb. S'il est possible d'utiliser une composition conductrice argent peu allié (ESL 9562G) pour les ...
EPFL-LPM2014High vacuum chemical vapour deposition of oxides: A review of technique development and precursor selection
Patrik Willi Hoffmann, Ali Dabirian, Yury Kuzminykh, Michael Oliver Reinke
Thin films of oxide materials are widely used for various types of applications. The selection of an appropriate deposition method depends on the aimed material and application. We review here a high vacuum chemical vapour deposition (HV-CVD) method, which ...
Elsevier2013Transparent, conducting Nb:SnO2 for host-guest photoelectrochemistry
Morgan Mertens Stefik, Nripan Mathews, Maurin Cornuz, Takashi Hisatomi
Many candidate materials for photoelectrochemical water splitting will be better employed by decoupling optical absorption from carrier transport. A promising strategy is to use multiple thin absorber layers supported on transparent, conducting materials; ...
Amer Chemical Soc2012Deformation and Damage in Lead-free Solder Joints
For environmental reasons, lead has been banned from microelectronic solder materials since the adoption of the RoHS legislation in 2006. A large number of investigations have lead to the development of new lead-free solder materials like the SnAgCu alloy ...
EPFL2012Correlation of microstructural and mechanical properties in particle reinforced lead-free solders
Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...
EPFL2009Characterization of the Residual Stresses and Strength of Ceramic-Metal Braze Joints
Residual stress relief in ceramic-metal joints produced by active brazing depends primarily on the plastic response of the filler metal. A procedure for the production and mechanical characterization of bulk active filler alloy specimens is developed. In p ...
2009Characterization of Interconnects Resulting from Capillary Die-to-Substrate Self-Assembly
Capillary fluidic self-assembly (SA) intrinsically features massively-parallel, contactless die handling and allows for high-precision die placement. It may thus boost die-to-substrate assembly throughput and scalability. Here we characterize for the first ...
IEEE2008Interfacial intermetallic growth and strength of composite lead-free solder alloy through isothermal aging
John Botsis, Joël Cugnoni, Venkatesh Sivasubramaniam
The effects of particle reinforcement of Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) lead-free solder on interfacial intermetallic layer growth and strength of the ensuing joints through short-term isothermal aging (150 degrees C) were studied. Composite solders were ...
Springer US2008