Publication

In-Situ Thin Film Growth of PbTiO3 By Multi Target Sputtering

Related publications (32)

Graph Chatbot

Chat with Graph Search

Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.

DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.

, , , , ,

A novel sensor based on thick-film + LTCC (low-temperature cofired ceramic) technology has been recently developed for sensing high-frequency 3D magnetic fields in tokamak fusion devices. For integration within the walls of the tokamak, the sensor has to b ...

IMAPS / ACerS2015

Tuning the porosity of zinc oxide electrodes: from dense to nanopillar films

Christophe Ballif, Benoît Florent Paul Delaup, Sylvain Nicolay, Björn Niesen, Monica Morales Masis, Lorenzo Fanni

Thin films with tunable porosity are of high interest in applications such as gas sensing and antireflective coatings. We report a facile and scalable method to fabricate ZnO electrodes with tuneable porosity. By adjusting the substrate temperature and rat ...

2015

Utilisation de brasure sans plomb pour le capteur de force CentoNewton

Thomas Maeder, Ludivine Ammon

Ce rapport décrit les tests effectués sur des capteurs CentoNewton-B en cours de productions pilotes, dans le but d’utiliser à l’avenir de la brasure sans plomb. S'il est possible d'utiliser une composition conductrice argent peu allié (ESL 9562G) pour les ...

EPFL-LPM2014

High vacuum chemical vapour deposition of oxides: A review of technique development and precursor selection

Patrik Willi Hoffmann, Ali Dabirian, Yury Kuzminykh, Michael Oliver Reinke

Thin films of oxide materials are widely used for various types of applications. The selection of an appropriate deposition method depends on the aimed material and application. We review here a high vacuum chemical vapour deposition (HV-CVD) method, which ...

Elsevier2013

Transparent, conducting Nb:SnO2 for host-guest photoelectrochemistry

Morgan Mertens Stefik, Nripan Mathews, Maurin Cornuz, Takashi Hisatomi

Many candidate materials for photoelectrochemical water splitting will be better employed by decoupling optical absorption from carrier transport. A promising strategy is to use multiple thin absorber layers supported on transparent, conducting materials; ...

Amer Chemical Soc2012

For environmental reasons, lead has been banned from microelectronic solder materials since the adoption of the RoHS legislation in 2006. A large number of investigations have lead to the development of new lead-free solder materials like the SnAgCu alloy ...

EPFL2012

Correlation of microstructural and mechanical properties in particle reinforced lead-free solders

Venkatesh Sivasubramaniam

Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...

EPFL2009

Residual stress relief in ceramic-metal joints produced by active brazing depends primarily on the plastic response of the filler metal. A procedure for the production and mechanical characterization of bulk active filler alloy specimens is developed. In p ...

2009

Capillary fluidic self-assembly (SA) intrinsically features massively-parallel, contactless die handling and allows for high-precision die placement. It may thus boost die-to-substrate assembly throughput and scalability. Here we characterize for the first ...

IEEE2008

, ,

The effects of particle reinforcement of Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) lead-free solder on interfacial intermetallic layer growth and strength of the ensuing joints through short-term isothermal aging (150 degrees C) were studied. Composite solders were ...

Springer US2008