In-Situ Thin Film Growth of PbTiO3 By Multi Target Sputtering
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Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...
A deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application, SwissCube’s motherboard (MB). Since 2006, using Pb in consumer electronics has been banned. Aerospac ...
A deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application, SwissCube’s motherboard (MB). Since 2006, using Pb in consumer electronics has been banned. Aerospac ...
2008
Diffusion Brazing (DB) of nickel-based superalloys is a standard joining process widely used in gas turbine industry. The DB technique uses a low melting nickel-based filler material, which contains a rapidly diffusing melting point depressant (MPD) such a ...
EPFL2004
Intermetallic thin films of stoichiometric NiAl and Ni3Al have been deposited onto n-type silicon (100) and nickel (110) substrates using r.f.-magnetron co-sputtering. The morphology and crystal structure of the thin films have been studied by transmission ...
2000
,
In this study, a deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application. Creep properties of this solder composition have been investigated, and results have ...
Int Assoc Engineers-Iaeng, Unit1, 1-F, 37-39 Hung To Road, Kwun Tong, Hong Kong, 00000, Peoples R China2008
The introduction of new packages as well as the ongoing miniaturization in SMT make the evaluation of the reliability of solder joints a permanent task. Passive thermal cycling is an important test to evaluate the lifetime of solder joints. However, tin-le ...
1997
Three different approaches for metal to ceramic brazing are compared using the example of Si3N4/TiN-steel joints: the use of an active filler metal (single layer brazing system), the metallisation of the ceramic and brazing with a non active filler (two-la ...
2007
Nowadays the joining of dissimilar materials is often the only solution to fulfill the complex requirements of high technology applications. One of the fields in which the research activity is more intense and promising is that of the brazing of ceramics w ...
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