Publication

Design and Analysis of Jitter-Aware Low-Power and High-Speed TSV Links for 3D ICs

Publications associées (36)

À propos
Confidentialité
Mentions légales

Graph Chatbot

Chattez avec Graph Search

Posez n’importe quelle question sur les cours, conférences, exercices, recherches, actualités, etc. de l’EPFL ou essayez les exemples de questions ci-dessous.

AVERTISSEMENT : Le chatbot Graph n'est pas programmé pour fournir des réponses explicites ou catégoriques à vos questions. Il transforme plutôt vos questions en demandes API qui sont distribuées aux différents services informatiques officiellement administrés par l'EPFL. Son but est uniquement de collecter et de recommander des références pertinentes à des contenus que vous pouvez explorer pour vous aider à répondre à vos questions.

Connectez-vous pour utiliser Chat avec Graph Search

Design and Analysis of Jitter-Aware Low-Power and High-Speed TSV Links for 3D ICs

Graph Chatbot

Chattez avec Graph Search

Signaling in 3-D integrated circuits, benefits and challenges

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Design Methodologies and CAD for Emerging Nanotechnologies

Cell Transformations and Physical Design Techniques for 3D Monolithic Integrated Circuits

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography

Thermal Simulation of Liquid-Cooled Integrated Circuits

Effects of Process Variations on 3-D Global Clock Distribution Networks

Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography

Thermal Simulation of Liquid-Cooled Integrated Circuits

Signaling in 3-D integrated circuits, benefits and challenges

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Design Methodologies and CAD for Emerging Nanotechnologies

Cell Transformations and Physical Design Techniques for 3D Monolithic Integrated Circuits

Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations

Effects of Process Variations on 3-D Global Clock Distribution Networks