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Design and Analysis of Jitter-Aware Low-Power and High-Speed TSV Links for 3D ICs

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Design and Analysis of Jitter-Aware Low-Power and High-Speed TSV Links for 3D ICs

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Signaling in 3-D integrated circuits, benefits and challenges

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Design Methodologies and CAD for Emerging Nanotechnologies

Cell Transformations and Physical Design Techniques for 3D Monolithic Integrated Circuits

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography

Thermal Simulation of Liquid-Cooled Integrated Circuits

Effects of Process Variations on 3-D Global Clock Distribution Networks

Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations

Cell Transformations and Physical Design Techniques for 3D Monolithic Integrated Circuits

Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Effects of Process Variations on 3-D Global Clock Distribution Networks

Signaling in 3-D integrated circuits, benefits and challenges

Thermal Simulation of Liquid-Cooled Integrated Circuits

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Design Methodologies and CAD for Emerging Nanotechnologies

Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography