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Copper TSV-Based Process Development for Die-Level Homogeneous and Heterogeneous 3D Integration Platform

Publications associées (68)

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Towards Scalable Electronics: Synthetic 2D Materials for Large-Area 2D Circuit Integration

Zhenyu Wang

In the past decades, a significant increase of the transistor density on a chip has led to exponential growth in computational power driven by Moore's law. To overcome the bottleneck of traditional von-Neumann architecture in computational efficiency, effo ...

EPFL2024

Eco-Conscious Approach to Wireless Gas Monitoring With a Hybrid Printed Passive Sensor Tag

Johanna Zikulnig, Jürgen Kosel

Addressing the environmental impact of electronic waste in biomedical sensing, an eco-conscious approach to the realization of a Chitosan-based Acetone sensor tag for wireless gas monitoring is presented. The fabrication involves inkjet printing of silver ...

Ieee-Inst Electrical Electronics Engineers Inc2024

Machine learning and data processing algorithms have been thriving in finding ways of processing and classifying information by exploiting the hidden trends of large datasets. Although these emerging computational methods have become successful in today's ...

EPFL2023

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We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufacturin ...

2021

A Real-Time Multi-Camera Depth Estimation ASIC with Custom On-Chip Embedded DRAM

Jonathan Emmanuel D Narinx

The capability to process high-resolution videos in real-time is becoming more important in a wide variety of applications such as autonomous vehicles, virtual reality or intelligent surveillance systems. The high-accuracy and complex video processing algo ...

EPFL2019

The revolution of information-technology owes to silicon-based complementary-metal-oxide (CMOS) technology. However, CMOS technology approaches its physical limitation hardening the further progress of memory devices as well as computing paradigm requiring ...

EPFL2019

Learning-Based Hardware Design for Data Acquisition Systems

Cosimo Aprile

This multidisciplinary research work aims to investigate the optimized information extraction from signals or data volumes and to develop tailored hardware implementations that trade-off the complexity of data acquisition with that of data processing, conc ...

EPFL2018

Design Optimization of 3D Multi-Processor System-on-Chip with Integrated Flow Cell Arrays

David Atienza Alonso, Marina Zapater Sancho, Ayse Kivilcim Coskun, Artem Andreev, Fulya Kaplan

Integrated flow cell array (FCA) is an emerging technology, targeting the cooling and power delivery challenges of modern 2D/3D Multi-Processor Systems-on-Chip (MPSoCs). In FCA, electrolytic solutions are pumped through microchannels etched in the silicon ...

2018

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Embedded memory remains a major bottleneck in current integrated circuit design in terms of silicon area, power dissipation, and performance; however, static random access memories (SRAMs) are almost exclusively supplied by a small number of vendors throug ...

Association for Computing Machinery2016

10.1 A pin-efficient 20.83Gb/s/wire 0.94pJ/bit forwarded clock CNRZ-5-coded SerDes up to 12mm for MCM packages in 28nm CMOS

Mohammad Amin Shokrollahi, Seyed Armin Tajalli, Christoph Walter, Ali Hormati, Anant Pratap Singh, Omid Talebi Amiri, Klaas Lammert Hofstra, Sergio Pesenti

High-speed signaling over package substrates is key to delivering the promise of 2.5D integration. Applications abound and include high-density memory interfaces, sub-division of large dies to increase yield and lower development time, sub-division of a di ...

2016