Publications associées à Simulation of silicon KOH and dry etching methods for micromould fabrication

Microstereolithography is a 3D microfabrication technology that is fundamentally different from the techniques commonly used in cleanroom environment for the manufacturing of microelectromechanical system (MEMS) components. Most microfabrication techniques ...

Elsevier2015

Operation and Control of Single-to-Three-Phase Direct AC/AC Modular Multilevel Converters under Asymmetric Grid Conditions

Alfred Rufer, Michail Vasiladiotis, Nicolas Cherix

Single-to-three-phase direct AC/AC Modular Multilevel Converters have gained a significant interest in the field of railway interties. The use of such an MMC-based structure implies more advanced control techniques as well as design requirements, especiall ...

2015

In-plane fabrication of insulated gold-tip probes for electrochemical and force spectroscopy molecular experiments

Nico de Rooij, Terunobu Akiyama, Sebastian Gautsch, Peter Van der Wal, Yexian Wu

A new and versatile fabrication process of insulated gold tip probes for atomic force microscopy (AFM) is presented by Wu et al. (In-plane fabricated insulated gold-tip probe for electrochemical and molecular experiments, in: 2013 IEEE 26th International C ...

Elsevier2014

In-Plane Fabricated Insulated Gold-Tip Probe For Electrochemical And Molecular Experiments

Nico de Rooij, Terunobu Akiyama, Sebastian Gautsch, Peter Van der Wal, Yexian Wu

In this contribution we present a scanning probe with a gold-tip completely encapsulated with insulator all the way to the apex. The probe fabrication is unique owing to an in-plane arrangement in which the width of the cantilever is defined by deep reacti ...

IEEE2013

Metal-coated silicon micropillars for freestanding 3D-electrode arrays in microchannels

Carlotta Guiducci, Samuel Kilchenmann, Elena Bianchi, Enrica Rollo

This paper presents a fabrication process for arrays of high-aspect-ratio micropillar electrodes, which are freestanding 3D structures that feature metal sidewalls connected to passivated planar wires. Facing vertical electrodes are considered to be a key ...

Elsevier2013

High aspect ratio etching of nanopores in PECVD SiC through AAO mask

Jürgen Brugger, Songmei Wu, Vaida Auzelyte, Wei Tang

We present in this work the fabrication of high aspect ratio nanopores in 500 nm PECVD SiC films through AAO (anodic aluminum oxide) mask. The initial AAO thin film is 180 nm thick and the diameter of nanopores is 33 ± 7 nm. We have used three plasma chemi ...

IEEE2013

Design and fabrication of a novel centimeter scale three dimensional silicon tip, tilt and piston mirror mechanism

François Barrot, Dara Zaman Bayat, Johannes Richard Cornelis Geerit Kruis, Rémy Fournier

A novel centimetre scale tip tilt piston mirror mechanism has been designed in silicon. The mirror consists of three identical mechanism parts and one mirror part. The fabrication of the parts was done with photolithography and Deep Reactive Ion Etching an ...

2013

High aspect ratio sub-micron trenches on silicon-on-insulator and bulk silicon

Mihai Adrian Ionescu, Cyrille Hibert, Daniel Grogg, Marion Hermersdorf

This paper reports on the fabrication of sub-micron trenches on silicon-on-insulator (SOI) required in many MEMS devices and on bulk silicon. Trenches in the range of 100-500 nm had been etched with the deep reactive ion etching (DRIE) by using the SHARP ( ...

2011

SiN membranes with submicrometer hole arrays patterned by wafer-scale nanosphere lithography

Jürgen Brugger, Andreea Veronica Savu, Nicolas Blondiaux, Oscar Vazquez Mena, Harry Heinzelmann, Mona Julia Katharina Klein, Raphaël Pugin, Franck Montagne

In this work, nanosphere lithography was integrated with standard microfabrication for the wafer-scale fabrication of silicon nitride (SiN) membranes with arrays of submicrometer holes. A monolayer of polystyrene (PS) beads with a mean diameter of 428 or 5 ...

2011

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Simulation of silicon KOH and dry etching methods for micromould fabrication

Microstereolithography

Operation and Control of Single-to-Three-Phase Direct AC/AC Modular Multilevel Converters under Asymmetric Grid Conditions

Microfluidic Scintillation Detectors for High Energy Physics

In-plane fabrication of insulated gold-tip probes for electrochemical and force spectroscopy molecular experiments

In-Plane Fabricated Insulated Gold-Tip Probe For Electrochemical And Molecular Experiments

Metal-coated silicon micropillars for freestanding 3D-electrode arrays in microchannels

High aspect ratio etching of nanopores in PECVD SiC through AAO mask

Design and fabrication of a novel centimeter scale three dimensional silicon tip, tilt and piston mirror mechanism

High aspect ratio sub-micron trenches on silicon-on-insulator and bulk silicon

SiN membranes with submicrometer hole arrays patterned by wafer-scale nanosphere lithography

Graph Chatbot

Chattez avec Graph Search

Microfluidic Scintillation Detectors for High Energy Physics

In-plane fabrication of insulated gold-tip probes for electrochemical and force spectroscopy molecular experiments

High aspect ratio etching of nanopores in PECVD SiC through AAO mask

Design and fabrication of a novel centimeter scale three dimensional silicon tip, tilt and piston mirror mechanism

SiN membranes with submicrometer hole arrays patterned by wafer-scale nanosphere lithography

In-Plane Fabricated Insulated Gold-Tip Probe For Electrochemical And Molecular Experiments

High aspect ratio sub-micron trenches on silicon-on-insulator and bulk silicon

Microstereolithography

Operation and Control of Single-to-Three-Phase Direct AC/AC Modular Multilevel Converters under Asymmetric Grid Conditions

Metal-coated silicon micropillars for freestanding 3D-electrode arrays in microchannels