Publication
The present invention relates to a method for fabricating an integrated electronic device with a microchannel, comprising the steps of: - Providing a homogeneous or heterogeneous substrate with one or more layers of material, respectively; - Forming at least one trench in the upper surface and through the upper layer using an etching process, particularly using a high aspect ratio etching process; - Sealing the trench by closing the opening of the trench on an upper surface of the upper layer.
David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Darong Huang, Rafael Medina Morillas