Carlotta Guiducci, Michail Zervas, Yusuf Leblebici, Yüksel Temiz
In this paper, a CMOS-compatible chip-to-chip 3D integration platform will be presented. The developed technology allows reconstituting a wafer from diced and thinned chips. Then, chip-to-chip bonding and TSV fabrication steps are accomplished in wafer-lev ...
IEEE2012