In engineering, electromechanics combines processes and procedures drawn from electrical engineering and mechanical engineering. Electromechanics focuses on the interaction of electrical and mechanical systems as a whole and how the two systems interact with each other. This process is especially prominent in systems such as those of DC or AC rotating electrical machines which can be designed and operated to generate power from a mechanical process (generator) or used to power a mechanical effect (motor). Electrical engineering in this context also encompasses electronics engineering.
Electromechanical devices are ones which have both electrical and mechanical processes. Strictly speaking, a manually operated switch is an electromechanical component due to the mechanical movement causing an electrical output. Though this is true, the term is usually understood to refer to devices which involve an electrical signal to create mechanical movement, or vice versa mechanical movement to create an electric signal. Often involving electromagnetic principles such as in relays, which allow a voltage or current to control another, usually isolated circuit voltage or current by mechanically switching sets of contacts, and solenoids, by which a voltage can actuate a moving linkage as in solenoid valves.
Before the development of modern electronics, electromechanical devices were widely used in complicated subsystems of parts, including electric typewriters, teleprinters, clocks, initial television systems, and the very early electromechanical digital computers. Solid-state electronics have replaced electromechanics in many applications.
The first electric motor was invented in 1822 by Michael Faraday. The motor was developed only a year after Hans Christian Ørsted discovered that the flow of electric current creates a proportional magnetic field. This early motor was simply a wire partially submerged into a glass of mercury with a magnet at the bottom.
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Micro- and nanofabrication can be taught to students and professionals by textbooks and ex-cathedra lectures, but the real learning comes from seeing the manufacturing steps as they happen. This MOOC
The student will learn process techniques and applications of modern micro- and nanofabrication, as practiced in a clean room, with a focus on silicon, but also multi-material microsystems and flexibl
Relay logic is a method of implementing combinational logic in electrical control circuits by using several electrical relays wired in a particular configuration. ladder logic The schematic diagrams for relay logic circuits are often called line diagrams, because the inputs and outputs are essentially drawn in a series of lines. A relay logic circuit is an electrical network consisting of lines, or rungs, in which each line or rung must have continuity to enable the output device.
A snubber is a device used to suppress ("snub") a phenomenon such as voltage transients in electrical systems, pressure transients in fluid systems (caused by for example water hammer) or excess force or rapid movement in mechanical systems. Snubbers are frequently used in electrical systems with an inductive load where the sudden interruption of current flow leads to a large counter-electromotive force: a rise in voltage across the current switching device that opposes the change in current, in accordance with Faraday's law.
Surface micromachining builds microstructures by deposition and etching structural layers over a substrate. This is different from Bulk micromachining, in which a silicon substrate wafer is selectively etched to produce structures. Generally, polysilicon is used as one of the substrate layers while silicon dioxide is used as a sacrificial layer. The sacrificial layer is removed or etched out to create any necessary void in the thickness direction. Added layers tend to vary in size from 2-5 micrometres.
MEMS (Microelectromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2.
Solid-state physics is the study of rigid matter, or solids, through methods such as solid-state chemistry, quantum mechanics, crystallography, electromagnetism, and metallurgy. It is the largest branch of condensed matter physics. Solid-state physics studies how the large-scale properties of solid materials result from their atomic-scale properties. Thus, solid-state physics forms a theoretical basis of materials science. Along with solid-state chemistry, it also has direct applications in the technology of transistors and semiconductors.
A microprocessor is a computer processor where the data processing logic and control is included on a single integrated circuit (IC), or a small number of ICs. The microprocessor contains the arithmetic, logic, and control circuitry required to perform the functions of a computer's central processing unit (CPU). The IC is capable of interpreting and executing program instructions and performing arithmetic operations.
Explores lithography in microfabrication technologies, covering thin film deposition, print resolution, process flow, and limitations imposed by diffraction.
In the past decades, a significant increase of the transistor density on a chip has led to exponential growth in computational power driven by Moore's law. To overcome the bottleneck of traditional von-Neumann architecture in computational efficiency, effo ...
During this project, the microfabrication of Hafnium Carbide (HfC) was investigated. Multiple tools were considered and tested for their compatibility and effectiveness when working with HfC. The main method of choice for the machining of HfC thin films wa ...
The project focuses on etching properties of the atomic layer deposition (ALD) of Al2O3. For this purpose, etching processes such as plasma etch with sulfur hexafluoride (SF6), gas etch with xenon difluoride (XeF2), wet etch with MIF developer (726 MIF) as ...