Publications related to Hermetic seal

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi, Göran Stemme

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling

Michel Rappaz, Aïcha Hessler-Wyser, Léa Deillon, Thierry Hessler

Au-In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu t ...

Institute of Physics2015

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

Nico de Rooij, Danick Briand, Yves Pétremand

This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...

Institute of Physics2013

An evaluation of thick-film silver die-attach as micro solid oxide fuel cells (μ-SOFCs) interconnection packaging

Paul Muralt, Thomas Maeder, Bo Jiang

Micro solid oxide fuel cells (μ-SOFCs) based on MEMS fabrication processes have become an increasingly attractive option for portable power generation applications, due to their high power density and their compatibility with hydrocarbon fuels. For system ...

IMAPS / ACerS2012

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

Frank Seigneur

The quantity of MEMS manufacturers has considerably been increasing these last years. This doesn't mean that the introduction of such products on the market has become easier. A packaging operation is needed to obtain a usable product out of a microsystem. ...

EPFL2009

Hermetic package for optical MEMS

Peter Ryser, Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally low t ...

2009

Flip chip bonding technologies for hybrid integration

Hybrid integration and especially the packaging of microelectromechanical systems (i.e. MEMS) cannot rely on standardised packaging solutions due to the diversity of microsystems. As an example, the packaging requirements of a pressure sensor are different ...

Institut de Microtechnique, Université de Neuchâtel2009

Hermetic package for optical MEMS

Peter Ryser, Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally low t ...

2008

LTCC active oxygen getter module for hermetic packaging applications

Peter Ryser, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur, Timothée Haller

LTCC and thick-film technologies constitute excellent platforms for hermetic and controlled-atmosphere packaging, for applications in MEMS, space, micro/nanofabrication and biological fields. This work presents an active oxygen getter module, based on an i ...

IMAPS2008

Microsystem technologies for implantable applications

Nico de Rooij

Microsystem technologies (MST) have become the basis of a large industry. The advantages of MST compared to other technologies provide opportunities for application in implantable biomedical devices. This paper presents a general and broad literature revie ...

2007

Hermetic seal

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

An evaluation of thick-film silver die-attach as micro solid oxide fuel cells (μ-SOFCs) interconnection packaging

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

Hermetic package for optical MEMS

Flip chip bonding technologies for hybrid integration

Hermetic package for optical MEMS

LTCC active oxygen getter module for hermetic packaging applications

Microsystem technologies for implantable applications

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Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

An evaluation of thick-film silver die-attach as micro solid oxide fuel cells (μ-SOFCs) interconnection packaging

Flip chip bonding technologies for hybrid integration

Hermetic package for optical MEMS

Hermetic package for optical MEMS

LTCC active oxygen getter module for hermetic packaging applications

Microsystem technologies for implantable applications

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling