Related publications (219)

Degradable and Printed Microstrip Line for Chipless Temperature and Humidity Sensing

Danick Briand, James Alec Pierce Bourely, Jaemin Kim, Xavier Aeby, Oleksandr Vorobyov

Research on chipless and passive architectures for environmental sensing is generating high interest because they do not require any semiconductor components or batteries to operate, thus resulting in an eco-friendlier footprint. This study demonstrates a ...
2024

Microstructural and electrical characterization of high temperature passivating contacts for silicon solar cells

Sofia Libraro

Recombination at metal/semiconductor interfaces represents the main limitation in mainstream c-Si solar cells, primarily based on the passivated emitter and rear cell (PERC) concept. Full-area passivating contacts based on SiOx/poly-Si stacks are a candida ...
EPFL2024

Dielectric Elastomer Actuator-Based Valveless Impedance-Driven Pumping for Meso- and Macroscale Applications

Yves Perriard, Yoan René Cyrille Civet, Thomas Guillaume Martinez, Francesco Clavica, Armando Matthieu Walter, Amine Benouhiba, Silje Ekroll Jahren

Impedance pumps are simple designs that allow the generation or amplification of flow. They are fluid-filled systems based on flexible tubing connected to tubing with different impedances. A periodic off-center compression of the flexible tubing causes the ...
2023

Intelligent plantar pressure offloading for the prevention of diabetic foot ulcers and amputations

Yves Perriard, Yoan René Cyrille Civet, Christian Köchli, Sofia Lydia Ntella, Kenny Jeanmonod, Bhawnath Tiwari

The high prevalence of lower extremity ulceration and amputation in people with diabetes is strongly linked to difficulties in achieving and maintaining a reduction of high plantar pressures (PPs) which remains an important risk factor. The effectiveness o ...
2023

Etching selectivity and passivity of Al2O3 layers

Anil Can Kahraman

The project focuses on etching properties of the atomic layer deposition (ALD) of Al2O3. For this purpose, etching processes such as plasma etch with sulfur hexafluoride (SF6), gas etch with xenon difluoride (XeF2), wet etch with MIF developer (726 MIF) as ...
2023

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