Residual stress

In materials science and solid mechanics, residual stresses are stresses that remain in a solid material after the original cause of the stresses has been removed. Residual stress may be desirable or undesirable. For example, laser peening imparts deep beneficial compressive residual stresses into metal components such as turbine engine fan blades, and it is used in toughened glass to allow for large, thin, crack- and scratch-resistant glass displays on smartphones. However, unintended residual stress in a designed structure may cause it to fail prematurely. Residual stresses can result from a variety of mechanisms including inelastic (plastic) deformations, temperature gradients (during thermal cycle) or structural changes (phase transformation). Heat from welding may cause localized expansion, which is taken up during welding by either the molten metal or the placement of parts being welded. When the finished weldment cools, some areas cool and contract more than others, leaving residual stresses. Another example occurs during semiconductor fabrication and microsystem fabrication when thin film materials with different thermal and crystalline properties are deposited sequentially under different process conditions. The stress variation through a stack of thin film materials can be very complex and can vary between compressive and tensile stresses from layer to layer. While uncontrolled residual stresses are undesirable, some designs rely on them. In particular, brittle materials can be toughened by including compressive residual stress, as in the case for toughened glass and pre-stressed concrete. The predominant mechanism for failure in brittle materials is brittle fracture, which begins with initial crack formation. When an external tensile stress is applied to the material, the crack tips concentrate stress, increasing the local tensile stresses experienced at the crack tips to a greater extent than the average stress on the bulk material.

Proliferation-driven mechanical compression induces signalling centre formation during mammalian organ development

Experimental and ab initio derivation of interface stress in nanomultilayered coatings: Application to immiscible Cu/W system with variable in-plane stress

Strain engineering and strain measurement by spring tethers on suspended epitaxial GaN-on-Si photonic crystal devices

Strain engineering and strain measurement by spring tethers on suspended epitaxial GaN-on-Si photonic crystal devices

Experimental and ab initio derivation of interface stress in nanomultilayered coatings: Application to immiscible Cu/W system with variable in-plane stress

Proliferation-driven mechanical compression induces signalling centre formation during mammalian organ development