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In the framework of the NanoTera project CabTuRes, a system-in-package for a nano-resonator was proposed, integrating CMOS driving electronics and vacuum encapsulation. This doctoral research aimed to investigate 3D-integration technologies for a Single-Wa ...
At the Microsystems for Space Technologies Laboratory, EPFL, we design and manufacture miniaturised silicone-based dielectric elastomer actuators (DEAs). We love silicone, because even though the achievable strain is generally smaller than what you can get ...
We present a novel technique for heterogeneous integration using gold filled Through Silicon Vias (TSV) and thermocompression bond bumps formed in a single fabrication step, using gold nanoparticles dispensed by inkjet printing. Gold-filled TSV arrays (12 ...
This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...
Pressure lies at the basis of operation of most microfluidic systems, and is a determinant factor in the extent of miniaturization and in limiting the throughput and time constant of the microfluidic assays. Despite the apparent importance given to fluidic ...
A micro-power energy harvesting system based on core(crystalline Si)-shell(amorphous Si) nanowire solar cells together with a nanowire-modified CMOS sensing platform have been developed to be used in a dust-sized autonomous chemical sensor node. The mote ( ...
Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...
At present, most of the tests involved in personalized medicine are complex and must be conducted in specialized centers. The development of appropriate, fast and inexpensive diagnostic technologies can encourage medical personnel in performing preventive ...
Hermiticity is an essential requirement of a MEMS package for a device to work properly. Hermeticity also must be preserved during the operations following packaging, during which the package bond should not remelt. Bonding temperature is limited however t ...
We demonstrate data storage on glass/silicon microfluidic devices fabricated using parylene-C as a bonding layer. In particular, we report intermediate parylene-C bonding layer fluorescence (iPBLF) and its use as an on-chip medium for data storage by dynam ...