Concept
Pin grid array
Related publications (54)
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Addressing the environmental impact of electronic waste in biomedical sensing, an eco-conscious approach to the realization of a Chitosan-based Acetone sensor tag for wireless gas monitoring is presented. The fabrication involves inkjet printing of silver ...
Ieee-Inst Electrical Electronics Engineers Inc2024Integrated silicon photonic MEMS
Niels Quack, Hamed Sattari, Alain Yuji Takabayashi
Silicon photonics has emerged as a mature technology that is expected to play a key role in critical emerging applications, including very high data rate optical communications, distance sensing for autonomous vehicles, photonic-accelerated computing, and ...
SPRINGERNATURE2023System, device and method for quantum correlation measurement with single photon avalanche diode arrays
Edoardo Charbon, Claudio Bruschini, Ivan Michel Antolovic
A system for photon correlation of an illuminated object and/or a light source, including a light source for illuminating the object or to correlate, an optical system having an object-facing side configured to face the object or the light source and a pro ...
2020Monolithic SPAD Arrays for High-Performance, Time-Resolved Single-Photon Imaging
Edoardo Charbon, Claudio Bruschini, Ivan Michel Antolovic, Samuel Burri, Arin Can Ülkü, Chunmin Zhang, Scott Anthony Lindner, Martin Wolf
SPAD (single-photon avalanche diode) arrays are single-photon sensors, which enable photon counting and unparalleled time-resolved imaging. In this paper, we will detail the architecture and characteristics of three representative SPAD arrays, implemented ...
IEEE2018Organoid arrays
Matthias Lütolf, Nathalie Brandenberg
The invention provides methods for producing arrays of organoids, the arrays thereof and uses of such arrays. ...
2018A Compact Modular Soft Surface With Reconfigurable Shape and Stiffness
Jamie Paik, Matthew Aaron Robertson, Wyatt Marshall Felt, Masato Murakami
A variety of reconfigurable surface devices, utilizing large numbers of actuated physical pixels to produce discretized 3D contours, have been developed for different purposes in research and industry. The difficulty of integrating many actuators in close ...
2018A Chip-Level Post-CMOS Via-Last Cu TSV Process for Multi-Layer Homogeneous 3D Integration
Seniz Esra Küçük, Yusuf Leblebici, Woo Yeong Cho
In this paper, a die-level CMOS post-processing scheme for 3D integration using the via-last approach is presented for multi-layer stacking. The process includes TSV fabrication, chip-to-chip bonding, and finally the TSV filling with Cu electroplating. The ...
Ieee2016