Concept

Soldering

Related publications (76)

Selection and design of brazing fillers for metal-ceramic joints

Three different approaches for metal to ceramic brazing are compared using the example of Si3N4/TiN-steel joints: the use of an active filler metal (single layer brazing system), the metallisation of the ceramic and brazing with a non active filler (two-la ...

2007

Method of manufacturing a module of photoelectrochemical cells with long-term stability

Described is a method of manufacturing a module with long-term stability even though it contains a non-heat-resistant material, in particular a photosensitizer. Two glass plates (1, 2) are connected to each other round their edges with an edge-sealing stru ...

2007

The constitutive response of brazing alloys and the residual stresses in ceramic-metal joints

Matteo Galli

Nowadays the joining of dissimilar materials is often the only solution to fulfill the complex requirements of high technology applications. One of the fields in which the research activity is more intense and promising is that of the brazing of ceramics w ...

EPFL2007

Assembly of microvalves actuated by PZT bender

Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

At small sizes, piezoelectric bending actuators are more practical and have more favorable downscaling properties than traditional electromagnets in the field of microfluidics. However, their application is limited by the difficulty of ensuring proper clam ...

2007

Superparamagnetic iron oxide nanoparticle coupled tissue soldering

Heinrich Hofmann, Alke Fink, Benedikt Steitz

The invention relates to superparamagnetic iron oxide nanoparticles for use in sutureless thermal mediated tissue fusion. The nanoparticles are dispersed in a biocompatible solder material and heated by application of an alternating electromagnetic field. ...

2007

Laser Sealed Packaging for Microsystems

Jacques Jacot, Frank Seigneur

Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...

2006

Laser soldered packaging hermeticity measurement using metallic conductor resistance

Jacques Jacot, Thomas Maeder, Frank Seigneur

Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...

2006

Laser Soldered Packaging Hermeticity Measurement Using Metallic Conductor Resistance

Jacques Jacot, Thomas Maeder, Frank Seigneur

Abstract: Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to s ...

2006

Properties and stability of thick-film resistors with low processing temperatures - effect of composition and processing parameters

Claudio Grimaldi, Thomas Maeder, Caroline Jacq, Sonia Vionnet Menot

In this work, the properties (sheet-resistance, temperature coefficient and piezoresistance / gauge factor) and stability of thick-film resistors with low firing temperatures (525...650°C) are studied. To this end, two low-melting lead borosilicate glass c ...

2006

Design and characterisation of low-cost thick-film piezoresistive force sensors for the 100 mN to 100 N range

Peter Ryser, Thomas Maeder, Giancarlo Corradini, Vincent Fahrny, Sven Nico Stauss

Two simple low-cost thick-film force sensor designs are optimised, characterised and tested in this work, combining calculations of sensor element and joint stresses, joint strength characterisation and measurement of complete sensors. All sensors are base ...

2005

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