Concept

Soldering

Related publications (76)

Interfacial intermetallic growth and strength of composite lead-free solder alloy through isothermal aging

John Botsis, Joël Cugnoni, Venkatesh Sivasubramaniam

The effects of particle reinforcement of Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) lead-free solder on interfacial intermetallic layer growth and strength of the ensuing joints through short-term isothermal aging (150 degrees C) were studied. Composite solders were ...

Springer US2008

Reliability Analysis of Lead-free Solders

John Botsis, Joël Cugnoni

In this study, a deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application. Creep properties of this solder composition have been investigated, and results have ...

Int Assoc Engineers-Iaeng, Unit1, 1-F, 37-39 Hung To Road, Kwun Tong, Hong Kong, 00000, Peoples R China2008

T0004 / Soldering wires to sensor contact pads

Thomas Maeder

The tedious and expensive process of attaching SIL contacts to the sensor edges may be advantageously replaced by soldering wires and cables directly to the sensor contact pads. However, this process is a bit more critical, as applying excessive heat can d ...

EPFL2008

The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi

Michel Rappaz, Tina Ventura

Alloys based on the Sn-0.7Cu-xNi system are potential Pb-free solders. In this paper we report on the solidification characteristics and microstructures of Sn-0.7Cu alloys containing 0-1,000 ppm nickel. The microstructural observations show that increasing ...

Springer Verlag2008

Piezoresistive properties of low-firing temperature thick-films on steel sensors

Peter Ryser, Thomas Maeder, Caroline Jacq, Giancarlo Corradini, Niklaus Johner

Thick-film materials are very advantageous for piezoresistive pressure and force sensors because of ease of processing, reliability and low cost. The standard substrate material used with thick-film technology for sensing is alumina, but its elastic modulu ...

2008

Solder Doped Polycaprolactone Scaffold Enables Solder Doped Polycaprolactone Scaffold Enables. Reproducible Laser Tissue Soldering

Heinrich Hofmann, Alke Fink

During the last 40 years a focus in research was put on sutureless tissue fusion, to handle the limits of conventional suturing such as vascular wall damage due to the enetrating needle, intraluminal foreign body reactions caused by non-absorbable suture m ...

2008

Hermetic package for optical MEMS

Peter Ryser, Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally low t ...

2008

Laser soldering of LTCC hermetic packages with minimal thermal impact

Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

A novel laser soldering method for hermetic packaging of temperature sensitive devices such as organic electronics, micro- and nanostructures is presented in this work. The package combines a thermally optimized LTCC (Low Temperature Co-fired Ceramic) base ...

2007

Laser soldering of piezoelectric actuator with minimal thermal impact

Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

Mechanical and electrical connecting of piezoelectric actuator is often done using conductive glue. Its advantage is not to heat the piezoelectric actuator during connection. But there are many disadvantages to gluing; the main one is curing time. Welding ...

2007

Experimental and numerical studies on size and constraining effects in lead-free solder joints

John Botsis, Joël Cugnoni, Venkatesh Sivasubramaniam

Search String Advanced > Saved Searches > ARTICLE TOOLS Get PDF (641K) Save to My Profile E-mail Link to this Article Export Citation for this Article Get Citation Alerts Request Permissions More Sharing ServicesShare | Share on citeuli ...

2007

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