Concept
Soldering
Related publications (76)
Hybrid soft-rigid electrical interconnection system
Stéphanie Lacour, Giuseppe Schiavone, Florian Dylan Fallegger
It is disclosed an electrical interconnection system comprising: i) an interconnection board comprising an intrinsically non elastic substrate, said substrate having a first face and an opposed second face, and at least one conductive track on and/or withi ...
2021Preliminary Tests of Soldered and Diffusion-Bonded Splices Between Nb3Sn Rutherford Cables for Graded High-Field Accelerator Magnets
Pierluigi Bruzzone, Davide Uglietti, Mithlesh Kumar, Vincenzo D'Auria
High-field accelerator magnets of the next generation will require coil grading in order to decrease the amount of superconductor and hence the magnet cost. The joints between Nb3Sn conductor grades must have low electrical resistance (
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2019Tack and deformation based sensorised gripping using conductive hot melt adhesive
The development of a universal method for grasping objects of varying morphology, material and size in unstructured environments remains an unsolved challenge. There is no one 'universal' solution which can function with low positional precision, can grasp ...
Institute of Electrical and Electronics Engineers Inc.2018Implantable electrode and method for manufacturing
Diego Ghezzi, Marta Jole Ildelfonsa Airaghi Leccardi
The invention relates to a method for manufacturing an electrode, preferably an implantable electrode array comprising the following steps: Applying (101) a layer of electrically conducting material (4) above a substrate material (1) for forming the electr ...
2018Development of a new family of phosphorous-free Pt-based bulk metallic glasses
Ludger Weber, Maïté Blank, Hamed Kazemi, Cyrill Werner Cattin
New BMGs exhibiting strong glass forming ability combined with high hardness have been developed based on the Pt-Si-B ternary system. The effects of partial substitution of platinum by transition metals of the group iron, cobalt, nickel, and copper, as wel ...
Elsevier2017Solutions for thermally mismatched brazing operations for ceramic tokamak magnetic sensor
Duccio Testa, Peter Ryser, Matthieu Toussaint, Thomas Maeder, Caroline Jacq, Philipp Windischhofer, Xinyue Jiang
To monitor high-frequency fluctuations of the equilibrium magnetic field in tokamaks, a 3D magnetic sensor has been developed. The sensor, which is positioned inside the vacuum vessel behind the protective tiles of the tokamak and is exposed to potential t ...
2016Multi-scale modeling of elasto-plastic response of SnAgCu lead-free solder alloys at different ageing conditions: Effect of microstructure evolution, particle size effects and interfacial failure
John Botsis, Joël Cugnoni, Milad Maleki
In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu joints are subjected to elevated homologous temperatures f ...
Elsevier2016