Publications related to Package testing

Ceramic modules for micro solid-oxide fuel cells

Paul Muralt, Peter Ryser, Thomas Maeder, Bo Jiang, Yan Yan

Micro solid-oxide fuel cells (μ-SOFCs) based on microfabrication processes are a promising alternative to batteries for supplying portable electronics, as very high energy densities may be achieved. However, a complete μ-SOFC module is a quite intricate st ...

IMAPS2011

Foil level packaging of a chemical gas sensor

Nico de Rooij, Danick Briand, Jérôme Courbat

A generic method for the packaging of transducers at the foil level is proposed and was demonstrated on chemical gas sensors made on a plastic foil. The processing was based on the lamination of pre-patterned polymeric structures on the fabricated devices ...

Institute of Physics2010

Electrical modeling and design of a wafer-level package for MEM resonators

Mihai Adrian Ionescu, Anja Skrivervik, Julien Perruisseau-Carrier, Marco Mazza

This paper presents the electrical design and characterization of a wafer-level, or 0-level, package for micro-electromechanical resonators. We start by identifying the requirements on the electrical parasitics of a packaged resonator, derived from an anal ...

Institute of Electrical and Electronics Engineers2010

Throughput Optimal Total Order Broadcast for Cluster Environments

Rachid Guerraoui, Bastian Pochon, Ron Levy

Total order broadcast is a fundamental communication primitive that plays a central role in bringing cheap software-based high availability to a wide range of services. This paper studies the practical performance of such a primitive on a cluster of homoge ...

Association for Computing Machinery2010

Physical Design Issues in 3-D Integrated Technologies

Vasileios Pavlidis

Design techniques for three-dimensional (3-D) ICs considerably lag the significant strides achieved in 3-D manufacturing technologies. Advanced design methodologies for 2-D circuits are not sufficient to manage the added complexity caused by the third dime ...

Springer-Verlag New York, Ms Ingrid Cunningham, 175 Fifth Ave, New York, Ny 10010 Usa2010

Sensors and packages based on LTCC and thick-film technology for severe conditions

Peter Ryser, Thomas Maeder, Caroline Jacq

Reliable operation in harsh environments such as high temperatures, high pressures, aggressive media and space, poses special requirements for sensors and packages, which usually cannot be met using polymer-based technologies. Ceramic technologies, especia ...

2009

0-level Vacuum Packaging RT Process for MEMS Resonators

Mihai Adrian Ionescu, Cyrille Hibert, Daniel Grogg, Nicolas Abelé

A new Room Temperature (RT) 0-level vacuum package is demonstrated in this work, using amorphous silicon (aSi) as sacrificial layer and SiO2 as structural layer. The process is compatible with most of MEMS resonators and Resonant Suspended-Gate MOSFET [1] ...

2008

LTCC active oxygen getter module for hermetic packaging applications

Peter Ryser, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur, Timothée Haller

LTCC and thick-film technologies constitute excellent platforms for hermetic and controlled-atmosphere packaging, for applications in MEMS, space, micro/nanofabrication and biological fields. This work presents an active oxygen getter module, based on an i ...

IMAPS2008

Evaluation of two commercial finite element packages for calculating AC losses in 2-D high temperature superconducting strips

Francesco Grilli, Frédéric Sirois, François Roy, Bertrand Dutoit

This paper compares the speed and accuracy of two commercial packages based on the finite element method (FEM) for calculating the AC losses in high temperature superconductors (HTS). The softwares investigated in this paper were COMSOL Multiphysics and FL ...

2008

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Package testing

Ceramic modules for micro solid-oxide fuel cells

Foil level packaging of a chemical gas sensor

Electrical modeling and design of a wafer-level package for MEM resonators

Throughput Optimal Total Order Broadcast for Cluster Environments

Physical Design Issues in 3-D Integrated Technologies

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

Sensors and packages based on LTCC and thick-film technology for severe conditions

0-level Vacuum Packaging RT Process for MEMS Resonators

LTCC active oxygen getter module for hermetic packaging applications

Evaluation of two commercial finite element packages for calculating AC losses in 2-D high temperature superconducting strips

Graph Chatbot

Chat with Graph Search

Electrical modeling and design of a wafer-level package for MEM resonators

Ceramic modules for micro solid-oxide fuel cells

Throughput Optimal Total Order Broadcast for Cluster Environments

Sensors and packages based on LTCC and thick-film technology for severe conditions

0-level Vacuum Packaging RT Process for MEMS Resonators

LTCC active oxygen getter module for hermetic packaging applications

Physical Design Issues in 3-D Integrated Technologies

Evaluation of two commercial finite element packages for calculating AC losses in 2-D high temperature superconducting strips

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles