Memory refresh

Summary

Memory refresh is the process of periodically reading information from an area of computer memory and immediately rewriting the read information to the same area without modification, for the purpose of preserving the information. Memory refresh is a background maintenance process required during the operation of semiconductor dynamic random-access memory (DRAM), the most widely used type of computer memory, and in fact is the defining characteristic of this class of memory. In a DRAM chip, each bit of memory data is stored as the presence or absence of an electric charge on a small capacitor on the chip. As time passes, the charges in the memory cells leak away, so without being refreshed the stored data would eventually be lost. To prevent this, external circuitry periodically reads each cell and rewrites it, restoring the charge on the capacitor to its original level. Each memory refresh cycle refreshes a succeeding area of memory cells, thus repeatedly refreshing all the cells in a consecutive cycle. This process is conducted automatically in the background by the memory circuitry and is transparent to the user. While a refresh cycle is occurring the memory is not available for normal read and write operations, but in modern memory this "overhead" time is not large enough to significantly slow down memory operation. Electronic memory that does not require refreshing is available, called static random-access memory (SRAM). SRAM circuits require more area on a chip, because an SRAM memory cell requires four to six transistors, compared to a single transistor and a capacitor for DRAM. As a result, data density is much lower in SRAM chips than in DRAM, and SRAM has higher price per bit. Therefore, DRAM is used for the main memory in computers, video game consoles, graphics cards and applications requiring large capacities and low cost. The need for memory refresh makes DRAM timing and circuits significantly more complicated than SRAM circuits, but the density and cost advantages of DRAM justify this complexity.

Official source

https://en.wikipedia.org/wiki/Memory_refresh

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The memory controller is a digital circuit that manages the flow of data going to and from the computer's main memory. A memory controller can be a separate chip or integrated into another chip, such as being placed on the same die or as an integral part of a microprocessor; in the latter case, it is usually called an integrated memory controller (IMC). A memory controller is sometimes also called a memory chip controller (MCC) or a memory controller unit (MCU).

Magnetic-core memory was the predominant form of random-access computer memory for 20 years between about 1955 and 1975. Such memory is often just called core memory, or, informally, core. Core memory uses toroids (rings) of a hard magnetic material (usually a semi-hard ferrite) as transformer cores, where each wire threaded through the core serves as a transformer winding. Two or more wires pass through each core. Magnetic hysteresis allows each of the cores to "remember", or store a state.

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Replica Bit-Line Technique for Internal Refresh in Logic-Compatible Gain-Cell Embedded DRAM

Robert Giterman, Odem Harel

Embedded memories, mostly implemented with static random access memory (SRAM), dominate the area and power of integrated circuits. Gain-cell embedded DRAM (GC-eDRAM) is an alternative to SRAM due to its high density, low power consumption, and two-ported functionality. However, GC-eDRAM requires periodic refresh cycles to maintain its data due to its dynamic storage mechanism. The refresh operation is typically handled at a memory controller level, resulting in an energy overhead and limited memory availability. In this paper, we propose a new approach for the realization of the refresh operation using an internal refresh mechanism, which supports an efficient row-wise refresh operation within a single clock cycle, providing 100% write access availability at a reduced refresh latency and power. An 8 kbit GC-eDRAM array with integrated internal refresh and replica bit-line was implemented, demonstrating up-to 30% reduced refresh latency and 65% reduced read energy at a low cost of 2.4% array area overhead, compared to a conventional GC-eDRAM array without internal refresh capabilities.

ELSEVIER SCI LTD2020

Since the emergence of Silicon On Insulator (SOI) technology the research activities have been concentrated on a detailed analysis of SOI devices and their use in different application fields (low-voltage, low-power circuits, high temperature electronics, digital circuits, etc.). The present thesis deals with low-voltage, low-power mixed-mode design using a SOI technology. The goal is to establish the concepts that allow one to design SOI mixed-mode circuits, and to apply these concepts to the design of fully depleted (FD) and partially depleted (PD) SOI circuits and systems. Two studies have been realized in the scope of this work: a Hall sensor based microsystem design using an experimental FD SOI technology a DRAM design using capacitor-less 1T floating-body PD SOI memory cells. At the beginning of this thesis, two major types of SOI devices are introduced, namely FD and PD devices. The most important properties of these devices are then presented and compared to those of CMOS bulk devices. A design methodology based on design retargeting from bulk to SOI technology is further proposed. This methodology is developed with the aim of being implemented for the design of FD SOI circuits. It consists in using the same device dimensions and bias currents for the bulk and the corresponding FD SOI design. The analysis performed proves that such an approach permits one to obtain better circuit performances using the FD SOI technology. The EKV model is chosen for Spice simulations. For that purpose the extraction of the EKV intrinsic parameters has been performed for the experimental 0.5 μm FD SOI technology. The EKV model card obtained from transistor measurements is implemented straightforwardly for circuit simulations. The first study presented in this thesis is an FD SOI Hall sensor front-end for energy measurement. The mixed-mode microsystem design is completely based on the proposed design methodology. The system level solutions are also included, such as the spinning-current method that serves for reduction of the offset and low frequency noise of the analog front-end, and a high resolution analog-to-digital conversion technique. The integrated microsystem is entirely functional. Furthermore, according to the existing literature, this integrated circuit is the first microsystem completely realized using FD SOI technology. The overall system error that is obtained is less than 1.5 %. During the second part of this work, a novel sensing scheme that exploits an automatic reference generation based on successive approximations has been developed for the PD SOI capacitor-less 1T DRAM. The 1T DRAM reference current is generated by an adjustable current source. The electrical calibration of the reference current is performed using a digital-to-analog converter and successive approximations algorithm. The proposed scheme is evaluated in a 2 kb test chip. The circuit integrated using PD SOI technology contains a 2 kb 1T memory array, as well as automatic reference generators and peripheral circuits. The automatic reference generator comprises current mode sense amplifier, M/3M converter, and successive approximations register. All blocks implemented in the test chip are described in detail, and PD SOI design issues are discussed. A number of experimental results demonstrate the potential of the PD SOI 1T DRAM for future embedded DRAM applications. The measured retention time under holding conditions is higher than 1s. In the continuous read mode, a few hundreds of the read cycles can be performed without a refresh operation. The test chip has a measured access time of 25 ns with a read cycle time of 70 ns.

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