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Metal fatigue during cyclic loading puts an endurance limit on most of today's technology. It impacts the reliability of metallic components used for transportation, electronic devices and energy production because fatigue failure can occur without any app ...
Integrated circuit packaging technology has become a prime design consideration for the develop-ment of electronic system concepts. One key issue is the bonding layer between chip and substrate. Currently, high-lead solder materials are being used, which a ...
Magnesium (Mg) alloys have recently been put under the spotlight for their specific strength, the highest among structural metals. Although the mechanical behaviour of Mg alloys at quasi-static strain rates has been extensively modelled in the recent years ...
Nanocrystalline (NC) metals have attracted widespread interest in materials science due to their high strength compared to coarse-grained counterparts. It is well know that during uniaxial deformation, the stress-strain behaviour exhibits an extraordinary ...
This work generalizes the one-step model previously developed on fcc-bcc martensitic transformations to the larger family of phase transitions in the fcc-bcc-hcp system. The angular distortive matrices are calculated for the bcc-fcc, bcc-hcp and fcc-hcp tr ...
The macroscopic strength of metals is determined by the dislocation arrangements that are formed when dislocations slip in the crystal lattice in response to the applied stress. Despite the extensive research carried out, the transition from uniform to non ...
The strain and compositional fluctuations of nearly lattice-matched Al0.81In0.19N/GaN heterostructures are investigated by cross-sectional scanning tunneling microscopy and selected area electron diffraction measurements in scanning electron transmission m ...
Dislocation dynamics are important to understand material plasticity effects, e.g. size dependent strain hardening. Dislocations are nucleated at nano-scale, and interact with other defects including grain boundaries and other dislocations at micro-scale. ...
Using atomistic simulations, the effect of jogs on the cross-slip of screw character dislocations and screw-dipole annihilation was examined for both FCC Cu and Ni. The stress-free activation energy for cross-slip at jogs is close to 0.4 eV in Cu, determin ...
Linear crystal defects called dislocations are one of the most fascinating concepts in materials science that govern mechanical and optoelectronic properties of many materials across a broad range of application. Three-dimensional (3-D) study of dislocatio ...