Concept

Electronics industry

Related publications (99)

Nanoengineered Silicon: Technology and Applications

Silicon has been, and continues to be, the material support of integrated circuit (IC) technology-the enabling tool of one of the most impressive technological, industrial and social revolution of mankind. Silicon (both in monocrystalline and polycrystalli ...

2011

Physical Properties of Al1-xInxN/(AIN)/GaN (0.07

Marcus Gonschorek

AlInN is a material which is known to be difficult to be grown among the III-nitride ternary compounds. It attracted much attention only recently and starts to be studied intensively mainly for electronic applications. The aim of this work is manifold. Var ...

EPFL2011

Thermal-Aware System-Level Modeling and Management for Multi-Processor Systems-on-Chip

Giovanni De Micheli, David Atienza Alonso, Luca Benini, Francesco Zanini

Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet commercially viable, solution to answer the strong and steadily growing demand for scalable and high performance systems, at limited design complexity. Howev ...

IEEE Press2011

Proposal and Validation of Medium-Frequency Power Transformer Design Methodology

Alfred Rufer, Irma Villar

Power electronics is continuously evolving toward higher power densities. Consequently, volume, weight, and material reduction are becoming major design issues, which lead the research focus toward high/medium-frequency power conversion systems. This paper ...

2011

Design, Fabrication and Characterization of a Gas Processing Unit Testing Platform for Micro-Solid Oxide Fuel Cells

Paul Muralt, Thomas Maeder, Bo Jiang, Dimos Poulikakos

Micro-scale solid oxide fuel cell is a promising power generation technology for portable devices such as laptop, medical devices and personal electronics. One of the key goals in design of μ-SOFC systems is to use common hydrocarbon fuels such as propane/ ...

Elsevier Science, Reg Sales Off, Customer Support Dept, 655 Ave Of The Americas, New York, Ny 10010 Usa2011

Integrated LTCC pressure / flow / temperature multisensor for compressed air diagnostics

Peter Ryser, Thomas Maeder, Yannick Sébastien Fournier, Nicolas Craquelin, Grégoire Boutinard Rouelle

We present a multisensor designed for industrial compressed air diagnostics and combining the measurement of pressure, flow, and temperature, integrated with the corresponding signal conditioning electronics in a single low-temperature co-fired ceramic (LT ...

2010

SMD pressure and flow sensor for compressed air in LTCC technology with integrated electronics

Peter Ryser, Thomas Maeder, Yannick Sébastien Fournier, Nicolas Craquelin, Jean-Bastien Coma

In this work, we present an integrated flow / pressure / temperature multisensor in LTCC (low- temperature co-fired ceramic) technology designed for diagnostics monitoring of standard industrial compressed air circuits and devices, such as valves and actua ...

2010

High-Mobility AlGaN/GaN Two-Dimensional Electron Gas Heterostructure Grown on (111) Single Crystal Diamond Substrate

Nicolas Grandjean, Marco Malinverni, Pierre Stadelmann, Denis Martin, Marcel Py, Marcus Gonschorek, Anas Mouti

High mobility Al0.28Ga0.72N/GaN two-dimensional electron gas (2DEG) is achieved on ( 111) oriented single crystal diamond substrate. The surface morphology of the epilayer is free of cracks thanks to the use of an AlN interlayer for strain relaxation. The ...

2010

SMD pressure and flow sensor for compressed air in LTCC technology with integrated electronics

Peter Ryser, Thomas Maeder, Yannick Sébastien Fournier, Nicolas Craquelin, Grégoire Boutinard Rouelle

We have designed and fabricated a low-range (ca. 100 mN) thick-film piezoresistive force sensor with a cantilever beam fabricated in LTCC (Low Temperature Co-fired Ceramic). The beam was soldered onto a standard thick-film 25.4 x 12.7 mm signal conditionin ...

Elsevier2009

Evaluation of building technology for mass producible millimetre-sized robots using flexible printed circuit boards

Initial tests of a building technology for a compact three-dimensional mass producible microrobot are presented. The 3.9 × 3.9 × 3.3 mm3 sized prototype robot represents a microsystem with actuators, sensors, energy management and integrated electronics. T ...

2009

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