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The design and characterization of an imaging sensor based on single photon avalanche diodes is presented. The sensor was fully integrated in a 0.35µm CMOS technology. The core of the imager is an array of 4x112 pixels that independently and simultaneously ...
As dictated by ongoing technology scaling and the advent of multi-core systems, each new generation of microprocessors and digital signal processors provides higher computing power and data throughput. However, the available bandwidth of the input/output ( ...
This work presents calculations and measurements on a novel low-cost thick-film force sensor design for the 100 N force range. The mechanical concept of these force sensors is based on a double ring biaxial load, which allows the fabrication of simple sens ...
One of the biggest challenges that are facing the Very Large Scale Integrated Circuits (VLSI) technologies today is the significant performance gap (3× to 9×) between full custom circuits and Application Specific Integrated Circuits (ASICs) designed in the ...
Solar blind detectors based on AlGaN heterostructures grown on sapphire by Molecular Beam Epitaxy and with a dielectric interference filter deposited on the back side are demonstrated to provide record spectral selectivity. Rejection ratios of 2 x 10(4), a ...
Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...
We demonstrated a continuously tunable optofluidic distributed feedback (DFB) dye laser on a monolithic poly(dimethylsiloxane) (PDMS) elastomer chip. The optical feedback was provided by a phase-shifted higher order Bragg grating embedded in the liquid cor ...
With their extremely low mass and volume, low power consumption and tight integration with electronics, MEMS sensors and actuators are extremely appealing for reducing the size and mass of spacecraft without sacrificing functionality. In view of the harsh ...
Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...
The fracture toughness of thin metal films confined between elastic layers is studied using a two-dimensional discrete dislocation (DD) method. Fracture along the metal/substrate interface is permitted through the use of a cohesive zone model. The predicte ...
