Control unit

Summary

The control unit (CU) is a component of a computer's central processing unit (CPU) that directs the operation of the processor. A CU typically uses a binary decoder to convert coded instructions into timing and control signals that direct the operation of the other units (memory, arithmetic logic unit and input and output devices, etc.). Most computer resources are managed by the CU. It directs the flow of data between the CPU and the other devices. John von Neumann included the control unit as part of the Von Neumann architecture. In modern computer designs, the control unit is typically an internal part of the CPU with its overall role and operation unchanged since its introduction. Multicycle control units The simplest computers use a multicycle microarchitecture. These were the earliest designs. They are still popular in the very smallest computers, such as the embedded systems that operate machinery. In a computer, the control unit often steps through the instruc

Official source

https://en.wikipedia.org/wiki/Control_unit

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3-D integrated circuits (3-D ICs) offer a promising solution to overcome the scaling limitations of 2-D ICs. However, using too many through-silicon-vias (TSVs) pose a negative impact on 3-D ICs due to the large overhead of TSV (e.g., large footprint and low yield). In this paper, we propose a new TSV sharing method for a circuit-switched 3-D mesh-of-tree (MoT) interconnect, which supports high-throughput and low-latency communication between processing cores and 3-D stacked multibanked L2 scratchpad memory. The proposed method supports traffic balancing and TSV-failure tolerant routing. The proposed method advocates a modular design strategy to allow stacking multiple identical memory dies without the need for different masks for dies at different levels in the memory stack. We also investigate various parameters of 3-D memory stacking (e.g., fabrication technology, TSV bonding technique, number of memory tiers, and TSV sharing scheme) that affect interconnect latency, system performance, and fabrication cost. Compared to conventional MoT interconnect that is straightforwardly adapted to 3-D integration, the proposed method yields up to (times 2.11) and (times 1.11) improvements in terms of cost efficiency (i.e., performance/cost) for microbump TSV bonding and direct Cu–Cu TSV bonding techniques, respectively.

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i-DPs CGRA: An Interleaved-Datapaths Reconfigurable Accelerator for Embedded Bio-signal Processing

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