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Covers the history, trends, challenges, and applications of printed electronics, emphasizing large area manufacturing processes and flexible substrates.
Covers the process integration in semiconductor fabrication, including twin-well process, isolation methods, threshold voltage adjustment, and silicide formation.
Explores proximity effect corrections in electron beam lithography for small and large features, emphasizing the importance of beam point spread function modeling.
Delves into the design, fabrication, and functionality of soft bio-integrated and bio-mimetic electronics for mobile health and human-centered robotics.