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This paper presents a serial link transceiver (TRX) architecture that enables high-speed data transmission over a lossy backplane channel without the presence of equalization circuits. The proposed architecture employs multi-tone signaling to reduce inter- ...
Ieee2016
To support growing data bandwidths, high-speed moderate-resolution ADCs have become vital for high-speed serial links. Interleaved SAR ADCs achieve high sampling speeds and good energy efficiency. However a challenge is that these ADCs are large and theref ...
Tachistoscopes allow brief visual stimulation delivery, crucial for experiments where subliminal presentation is required. Up to now, tachistoscopes have shortcomings regarding timing accuracy, reliability, and flexibility of use. Here, we present a new an ...
Tachistoscopes allow brief visual stimulation delivery, which is crucial for experiments in which subliminal presentation is required. Up to now, tachistoscopes have had shortcomings with respect to timing accuracy, reliability, and flexibility of use. Her ...
This study presents a wireless power and data transmission system to overcome the problems in intracranial epilepsy monitoring associated with transcutaneous wires. Firstly, a wireless power transfer link based on inductive coupling is implemented and a po ...
Spie-Int Soc Optical Engineering2013
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3D integration can alleviate routing congestion, reducing the wirelength and improving performances. Nevertheless, each TSV still occupies non-negligible silicon area: as the number of TSV increases, their effect on the chip routing is detrimental. The red ...
Elsevier2016
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Background: Maximum Intensity Projections (MIP) of neuronal dendritic trees obtained from confocal microscopy are frequently used to study the relationship between tree morphology and mechanosensory function in the model organism C. elegans. Extracting den ...
Biomed Central Ltd2014
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3D-ICs based on TSV technology provide high bandwidth inter-chip connections. The drawback is that most of the existing TSVs consume a large amount of silicon real estate. We present circuit-level design and analysis of area efficient, low power, high-data ...
3D-ICs based on TSV technology provide high bandwidth inter-chip connections. The drawback is that most of the existing TSVs consume a large amount of silicon real estate. We present circuit-level design and analysis of area efficient, low power, high-data ...
The distinct lattice spring model (DLSM) is a newly developed numerical tool for modeling rock dynamics problems, i.e. dynamic failure and wave propagation. In this paper, parallelization of DLSM is presented. With the development of parallel computing tec ...
