Soldering and Brazing: Fundamentals and Techniques

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Related lectures (13)

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Introduction and Definitions: Seminar Topics

Introduces assembly techniques, covering joining technology, welding processes, joint functionality, and classification of joints.

Packaging of Intelligent Systems

Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.

Soldering Components: Breakout Board Assembly

Focuses on soldering components on a breakout board with precision and avoiding short circuits.

Packaging of Intelligent Systems

Explores constraints in packaging systems, hierarchical assembly, chip packaging process, solder importance, and Pb-free solders.

Chip Packaging Process Flow: Major Steps

Covers the major steps in chip packaging and the evolution of packaging technologies.

Hexagonal Lattice in Mg Alloys

Covers the hexagonal lattice in Mg alloys, strengthening mechanisms, intermetallic structural alloys, and failure case analysis.

Mechanical Systems: Assembly Techniques

Explores assembly techniques in mechanical systems, covering bolted joints, brazing, welding, and gluing, as well as the principles of tightening nuts and self-locking in screw-nut assemblies.

Assembly: Physics of Manufacturing

Explores assembly processes, labor costs, joining methods, and automation challenges in manufacturing.

Phase Transformations in Al-Cu Alloys: Microstructure and Kinetics

Covers the Al-Cu binary system, focusing on phase transformations and their impact on microstructure and mechanical properties.

Structural Intermetallic Alloys

Explores the characteristics and properties of structural intermetallic alloys, including Laves phases, Hume-Rothery phases, and closed packed phases.