Packaging of Intelligent Systems

This lecture covers the constraints impacting the packaging of systems with displays, batteries, microprocessors, and memory, as well as the hierarchical assembly of components in integrated systems. It also delves into the packaging of silicon integrated circuits, the hierarchy in microelectronics, and the chip packaging process flow. The discussion includes singulation technologies, advantages and disadvantages of cleaving, and the major steps in chip packaging such as dicing, wire bonding, and moulding. Furthermore, it explores the importance of solder in microelectronics, the classic Pb-Sn solder, and considerations for adding elements to tin. The lecture concludes with insights on Pb-free solders, their compositions, and concerns related to Cu dissolution, excessive IMCS, and voids.