Packaging of Intelligent Systems

In course

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Description

This lecture covers the packaging of intelligent systems, focusing on solder systems like Sn-Ag-Cu, Pb-Free Solders, and solder deposition processes. It also discusses packaging trends, major chip interconnection types, and the evolution of packaging technologies over time.

Instructors (2)

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Official source

https://mediaspace.epfl.ch/media/0_jlk39bm0

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Ontological neighbourhood

Computer engineering

Hardware engineering: Microprocessors

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